CY7C1314SV18-200BZC

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Mfr.Part #
CY7C1314SV18-200BZC
Manufacturer
Infineon Technologies
Package / Case
165-LBGA
Datasheet
Download
Description
IC SRAM 18MBIT PARALLEL 165FBGA
Stock
44,978
In Stock :
44,978

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Manufacturer :
Infineon Technologies
Product Category :
Memory
Memory Interface :
Parallel
Supplier Device Package :
165-FBGA (13x15)
Memory Type :
Volatile
Clock Frequency :
200MHz
Voltage - Supply :
1.7V~1.9V
RoHS Status :
Non-RoHS Compliant
Packaging :
Tray
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Memory Size :
18Mb 512K x 36
Memory Format :
SRAM
Mounting Type :
Surface Mount
Operating Temperature :
0°C~70°C TA
Package / Case :
165-LBGA
Datasheets
CY7C1314SV18-200BZC
Introducing Memory Infineon Technologies CY7C1314SV18-200BZC from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Operating Temperature:0°C~70°C TA, Package / Case:165-LBGA, CY7C1314SV18-200BZC pinout, CY7C1314SV18-200BZC datasheet PDF, CY7C1314SV18-200BZC amp .Beyond Memory Infineon Technologies CY7C1314SV18-200BZC ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Infineon Technologies CY7C1314SV18-200BZC


Memory Infineon Technologies CY7C1314SV18-200BZC Overview

The Memory Infineon Technologies CY7C1314SV18-200BZC is a high-performance 18Mbit SRAM device featuring a parallel interface and housed in a compact 165FBGA package. Designed by Infineon Technologies, a leader in semiconductor solutions, this memory module excels in delivering rapid access times and high data bandwidth, making it ideal for advanced computing and networking applications. Its robust design ensures reliable operation even in demanding environments, positioning it as a perfect solution for designers seeking to enhance the performance and efficiency of their systems.

CY7C1314SV18-200BZC Features

This IC SRAM product from Infineon Technologies stands out with its 18Mbit storage capacity, facilitating large-scale data handling and storage. The parallel interface ensures fast data transfer rates, suitable for high-performance computing tasks. Additionally, the 165FBGA packaging not only allows for a compact footprint on system boards but also enhances the thermal stability and overall reliability of the device.

CY7C1314SV18-200BZC Applications

  • Networking Equipment: Utilized in routers and switches to manage data buffers efficiently, ensuring high-speed data processing and reliability in network traffic management.
  • Telecommunications: Plays a critical role in telecommunications infrastructure by providing rapid access to data which is essential for real-time communication applications.
  • High-Performance Computing: Ideal for use in servers and supercomputers where large volumes of data require fast access and processing to handle complex computations and large datasets effectively.
  • Automotive Electronics: Supports advanced automotive systems, such as driver-assistance systems, by ensuring quick data retrieval which is crucial for real-time decision making.
  • Industrial Automation: Helps in managing operations smoothly in automated production lines, where speed and data integrity are critical for system performance and reliability.
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Shipping Cost

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