CY7C1314CV18-250BZC
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- Mfr.Part #
- CY7C1314CV18-250BZC
- Manufacturer
- Infineon Technologies
- Package / Case
- 165-LBGA
- Datasheet
- Download
- Description
- IC SRAM 18MBIT PARALLEL 165FBGA
- Stock
- 39,464
- In Stock ：
- 39,464
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Memory
- Clock Frequency :
- 250MHz
- Mount :
- Surface Mount
- Supply Voltage :
- 1.8V
- Length :
- 15mm
- Height Seated (Max) :
- 1.4mm
- Packaging :
- Tray
- Terminal Pitch :
- 1mm
- Sync/Async :
- SYNCHRONOUS
- Operating Supply Voltage :
- 1.8V
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Memory Type :
- Volatile
- Terminal Position :
- BOTTOM
- Access Time :
- 450 ps
- Number of Ports :
- 2
- Pin Count :
- 165
- Peak Reflow Temperature (Cel) :
- 220
- Package / Case :
- 165-LBGA
- Number of Functions :
- 1
- Memory Width :
- 36
- Density :
- 18 Mb
- Number of Terminations :
- 165
- Standby Current-Max :
- 0.45A
- Nominal Supply Current :
- 900mA
- Additional Feature :
- PIPELINED ARCHITECTURE
- Reach Compliance Code :
- not_compliant
- Memory Format :
- SRAM
- Qualification Status :
- Not Qualified
- Address Bus Width :
- 18b
- Terminal Finish :
- Tin/Lead (Sn/Pb)
- Published :
- 2003
- Memory Interface :
- Parallel
- Standby Voltage-Min :
- 1.7V
- Voltage - Supply :
- 1.7V~1.9V
- Base Part Number :
- CY7C1314
- Supply Voltage-Max (Vsup) :
- 1.9V
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Lead Free :
- Contains Lead
- I/O Type :
- Separate
- JESD-609 Code :
- e0
- Operating Temperature :
- 0°C~70°C TA
- Number of Pins :
- 165
- Output Characteristics :
- 3-STATE
- Word Size :
- 36b
- Mounting Type :
- Surface Mount
- Memory Size :
- 18Mb 512K x 36
- RoHS Status :
- Non-RoHS Compliant
- Supply Voltage-Min (Vsup) :
- 1.7V
- Datasheets
- CY7C1314CV18-250BZC
Memory Infineon Technologies CY7C1314CV18-250BZC Overview
The Memory Infineon Technologies CY7C1314CV18-250BZC is a high-performance 18Mbit SRAM module designed to meet the rigorous demands of high-speed data storage and processing applications. Manufactured by Infineon Technologies, this SRAM features a parallel interface and is encapsulated in a compact 165FBGA package. It is engineered to provide reliable, high-speed access to data, which is essential for enhancing the performance of advanced computing and networking systems. The integration of robust technology and compact design makes it an ideal choice for developers looking to implement a memory solution that offers both high capacity and speed.
CY7C1314CV18-250BZC Features
This SRAM chip boasts several features that make it particularly suitable for sophisticated electronics that require rapid data access and high reliability:
- 18Mbit Capacity: Large enough to handle complex data sets and intensive processing tasks.
- Parallel Interface: Ensures fast data transfer rates that are essential for high-performance applications.
- 165FBGA Package: Provides a robust and space-efficient encapsulation, facilitating easier integration into various circuit designs.
- High Reliability: Manufactured by Infineon Technologies, a leader in semiconductor solutions, ensuring consistent performance and durability.
CY7C1314CV18-250BZC Applications
- Networking Equipment: Used in routers and switches for buffering data packets, enhancing the speed and efficiency of network communication.
- High-Performance Computing: Integral in servers and workstations to manage large volumes of data and complex operations, contributing to faster processing and increased system stability.
- Embedded Systems: Provides the necessary data storage for real-time processing in applications such as robotics and automotive systems, where quick data retrieval is crucial.
- Telecommunications: Employs in telecommunications infrastructure to ensure rapid access to data, which is vital for the management of communication systems and services.
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