CY7C1314CV18-200BZC

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Mfr.Part #
CY7C1314CV18-200BZC
Manufacturer
Infineon Technologies
Package / Case
165-LBGA
Datasheet
Download
Description
IC SRAM 18MBIT PARALLEL 165FBGA
Stock
18,196
In Stock :
18,196

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Manufacturer :
Infineon Technologies
Product Category :
Memory
Clock Frequency :
200MHz
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Additional Feature :
PIPELINED ARCHITECTURE
Memory Interface :
Parallel
Supply Voltage :
1.8V
Pbfree Code :
No
Memory Size :
18Mb 512K x 36
Memory Density :
18874368 bit
Terminal Finish :
TIN LEAD
Terminal Pitch :
1mm
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Surface Mount :
yes
Organization :
512KX36
Width :
13mm
Memory Format :
SRAM
Reach Compliance Code :
Unknown
Memory Width :
36
Memory Type :
Volatile
Supply Voltage-Max (Vsup) :
1.9V
Packaging :
Tray
Mounting Type :
Surface Mount
Voltage - Supply :
1.7V~1.9V
JESD-609 Code :
e0
Package / Case :
165-LBGA
Pin Count :
165
Access Time (Max) :
0.45 ns
Length :
15mm
Height Seated (Max) :
1.4mm
Terminal Position :
BOTTOM
Qualification Status :
COMMERCIAL
RoHS Status :
Non-RoHS Compliant
Number of Functions :
1
Number of Terminations :
165
Operating Temperature :
0°C~70°C TA
JESD-30 Code :
R-PBGA-B165
Peak Reflow Temperature (Cel) :
220
Supply Voltage-Min (Vsup) :
1.7V
Introducing Memory Infineon Technologies CY7C1314CV18-200BZC from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Package / Case:165-LBGA, Number of Terminations:165, Operating Temperature:0°C~70°C TA, CY7C1314CV18-200BZC pinout, CY7C1314CV18-200BZC datasheet PDF, CY7C1314CV18-200BZC amp .Beyond Memory Infineon Technologies CY7C1314CV18-200BZC ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Infineon Technologies CY7C1314CV18-200BZC


Memory Infineon Technologies CY7C1314CV18-200BZC Overview

The Memory Infineon Technologies CY7C1314CV18-200BZC is a high-performance, 18Mbit SRAM module, housed in a compact 165FBGA package. This product, manufactured by Infineon Technologies, offers robust parallel interfacing, making it a perfect solution for applications demanding high-speed data retrieval and real-time processing. Its design focuses on achieving low-latency and high bandwidth capabilities, making it ideal for advanced computing and networking systems where performance and reliability are critical. The incorporation of cutting-edge technology and its substantial storage capacity ensure that it meets the specific requirements of industrial, telecommunications, and high-end computing markets.

CY7C1314CV18-200BZC Features

This integrated circuit features an 18Mbit memory size with a parallel interface, providing rapid access and high throughput. The device's compact 165FBGA packaging ensures a minimal footprint on system boards, facilitating more efficient layout and design of hardware. Additionally, its advanced technology allows for reliable operation under extended temperatures, which is crucial for harsh-environment applications.

CY7C1314CV18-200BZC Applications

  • Telecommunications Equipment: Utilized in routers and switches for buffer memory, aiding in efficient data flow and speed optimization.
  • Networking Hardware: Serves as cache memory in network bridges, ensuring quick data transfer rates and reduced latency in communication.
  • High-performance Computing: Applied in servers and workstations to enhance processing speed and reliability for complex computations and data analysis.
  • Industrial Automation: Used in PLCs and CNC machines for real-time control tasks, improving system response times and operational efficiency.
  • Aerospace and Defense: Implements in avionics and military hardware for high-speed data logging and real-time system monitoring.
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