CY7C1314BV18-250BZC

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Mfr.Part #
CY7C1314BV18-250BZC
Manufacturer
Infineon Technologies
Package / Case
165-LBGA
Datasheet
Download
Description
IC SRAM 18MBIT PARALLEL 165FBGA
Stock
20
In Stock :
20

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Manufacturer :
Infineon Technologies
Product Category :
Memory
JESD-609 Code :
e0
Terminal Pitch :
1mm
Access Time (Max) :
0.45 ns
Qualification Status :
COMMERCIAL
Voltage - Supply :
1.7V~1.9V
Memory Size :
18Mb 512K x 36
Memory Density :
18874368 bit
Width :
13mm
Clock Frequency :
250MHz
Terminal Finish :
TIN LEAD
Operating Temperature :
0°C~70°C TA
Number of Terminations :
165
Pbfree Code :
No
Package / Case :
165-LBGA
Peak Reflow Temperature (Cel) :
220
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
JESD-30 Code :
R-PBGA-B165
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
RoHS Status :
Non-RoHS Compliant
Surface Mount :
yes
Supply Voltage-Max (Vsup) :
1.9V
Supply Voltage-Min (Vsup) :
1.7V
Organization :
512KX36
Memory Format :
SRAM
Reach Compliance Code :
Unknown
Pin Count :
165
Memory Type :
Volatile
Height Seated (Max) :
1.4mm
Terminal Position :
BOTTOM
Memory Interface :
Parallel
Supply Voltage :
1.8V
Additional Feature :
PIPELINED ARCHITECTURE
Packaging :
Tray
Number of Functions :
1
Mounting Type :
Surface Mount
Length :
15mm
Memory Width :
36
Introducing Memory Infineon Technologies CY7C1314BV18-250BZC from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C~70°C TA, Number of Terminations:165, Package / Case:165-LBGA, Mounting Type:Surface Mount, CY7C1314BV18-250BZC pinout, CY7C1314BV18-250BZC datasheet PDF, CY7C1314BV18-250BZC amp .Beyond Memory Infineon Technologies CY7C1314BV18-250BZC ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Infineon Technologies CY7C1314BV18-250BZC


Memory Infineon Technologies CY7C1314BV18-250BZC Overview

Introducing the Memory Infineon Technologies CY7C1314BV18-250BZC, a state-of-the-art Integrated Circuit (IC) tailored for high-speed and high-density storage requirements. This IC SRAM features an 18Mbit capacity with a parallel interface, housed in a compact 165FBGA package, offering superior performance and reliability. Designed by Infineon Technologies, a leader in semiconductor solutions, this product is engineered to meet the rigorous demands of advanced computing and data storage systems. The incorporation of leading-edge technology into the design allows for significant improvements in data integrity and speed, making it ideal for businesses looking to enhance system performance and scalability.

CY7C1314BV18-250BZC Features

The CY7C1314BV18-250BZC IC SRAM from Infineon Technologies is built for optimal functionality with features that include a vast 18Mbit storage capacity, a high-speed parallel interface for quick data access, and a 165FBGA package that ensures a minimal footprint on system boards. These characteristics make it an excellent choice for developers requiring high performance and reduced power consumption in their applications.

CY7C1314BV18-250BZC Applications

  • Advanced Computing Systems: Utilizes its high-speed parallel interface and large memory capacity to manage large datasets and complex algorithms efficiently.
  • Networking Equipment: Employs its quick data access capabilities to enhance the performance of routers, switches, and other network infrastructure devices.
  • Telecommunications: Supports high-demand telecommunications applications, such as signal processing and buffering in communication arrays.
  • Industrial Automation: Integrates seamlessly into control systems for real-time processing and storage, improving automation and monitoring.
  • Automotive Electronics: Provides robust, reliable data storage and processing capabilities essential for advanced driver-assistance systems (ADAS) and other automotive applications.
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Shipping Cost

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