CY7C1313CV18-200BZC

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Mfr.Part #
CY7C1313CV18-200BZC
Manufacturer
Infineon Technologies
Package / Case
165-LBGA
Datasheet
Download
Description
IC SRAM 18MBIT PARALLEL 165FBGA
Stock
50
In Stock :
50

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Manufacturer :
Infineon Technologies
Product Category :
Memory
Additional Feature :
PIPELINED ARCHITECTURE
Clock Frequency :
200MHz
Memory Density :
18874368 bit
Supply Voltage-Min (Vsup) :
1.7V
Supply Voltage :
1.8V
Organization :
1MX18
Terminal Pitch :
1mm
Memory Size :
18Mb 1M x 18
Access Time (Max) :
0.45 ns
Number of Functions :
1
JESD-30 Code :
R-PBGA-B165
Memory Type :
Volatile
Mounting Type :
Surface Mount
Qualification Status :
COMMERCIAL
Memory Width :
18
Packaging :
Tray
Voltage - Supply :
1.7V~1.9V
Number of Terminations :
165
Memory Format :
SRAM
Pin Count :
165
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Reach Compliance Code :
Unknown
Terminal Finish :
NOT SPECIFIED
Package / Case :
165-LBGA
Height Seated (Max) :
1.4mm
Terminal Position :
BOTTOM
Operating Temperature :
0°C~70°C TA
RoHS Status :
Non-RoHS Compliant
Memory Interface :
Parallel
Width :
13mm
Length :
15mm
Supply Voltage-Max (Vsup) :
1.9V
Surface Mount :
yes
Introducing Memory Infineon Technologies CY7C1313CV18-200BZC from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Number of Terminations:165, Package / Case:165-LBGA, Operating Temperature:0°C~70°C TA, CY7C1313CV18-200BZC pinout, CY7C1313CV18-200BZC datasheet PDF, CY7C1313CV18-200BZC amp .Beyond Memory Infineon Technologies CY7C1313CV18-200BZC ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Infineon Technologies CY7C1313CV18-200BZC


Memory Infineon Technologies CY7C1313CV18-200BZC Overview

The Memory Infineon Technologies CY7C1313CV18-200BZC is a high-performance IC SRAM, engineered to meet the demands of advanced high-speed data processing systems. This 18Mbit SRAM with a parallel interface is housed in a compact 165FBGA package, offering robust data storage and retrieval capabilities. Designed by Infineon Technologies, a leader in semiconductor innovation, the CY7C1313CV18-200BZC is tailored for applications requiring fast access and high bandwidth. Its reliability and speed make it ideal for intensive applications in various industrial sectors.

CY7C1313CV18-200BZC Features

This SRAM component stands out due to its dense 18Mbit storage capacity and 200MHz clock speed, enabling high-speed data transactions. The parallel interface ensures compatibility with a wide range of existing technologies, making it versatile for integration. Additionally, its 165FBGA package is designed for efficient space utilization and reduced power consumption, which is critical for modern electronic devices.

CY7C1313CV18-200BZC Applications

  • Telecommunications Equipment: Utilized in routers and switches for fast data buffering and quick access, enhancing network efficiency.
  • Automotive Electronics: Used in advanced driver-assistance systems (ADAS) to process real-time data, contributing to safer driving experiences.
  • Industrial Automation: Serves as a reliable memory solution in robotics and control systems, where quick data access is crucial for operational accuracy.
  • Medical Devices: Implements in imaging devices like CT and MRI machines, where large amounts of data need to be processed quickly and reliably.
  • Consumer Electronics: Integrated into gaming consoles and high-performance computers for enhanced processing speed and user experience.
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