CY7C1313BV18-167BZC

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Mfr.Part #
CY7C1313BV18-167BZC
Manufacturer
Infineon Technologies
Package / Case
165-LBGA
Datasheet
Download
Description
IC SRAM 18MBIT PARALLEL 165FBGA
Stock
6
In Stock :
6

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Manufacturer :
Infineon Technologies
Product Category :
Memory
Additional Feature :
PIPELINED ARCHITECTURE
Clock Frequency :
167MHz
Memory Interface :
Parallel
Supply Voltage :
1.8V
Width :
13mm
Length :
15mm
Number of Functions :
1
Terminal Position :
BOTTOM
Terminal Pitch :
1mm
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Supply Voltage-Min (Vsup) :
1.7V
RoHS Status :
Non-RoHS Compliant
Number of Terminations :
165
Peak Reflow Temperature (Cel) :
220
Organization :
1MX18
Reach Compliance Code :
Unknown
Mounting Type :
Surface Mount
JESD-30 Code :
R-PBGA-B165
Pin Count :
165
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Memory Width :
18
Voltage - Supply :
1.7V~1.9V
Memory Type :
Volatile
Package / Case :
165-LBGA
Operating Temperature :
0°C~70°C TA
Height Seated (Max) :
1.4mm
Supply Voltage-Max (Vsup) :
1.9V
JESD-609 Code :
e0
Qualification Status :
COMMERCIAL
Terminal Finish :
TIN LEAD
Access Time (Max) :
0.5 ns
Packaging :
Tray
Memory Density :
18874368 bit
Pbfree Code :
No
Memory Size :
18Mb 1M x 18
Memory Format :
SRAM
Surface Mount :
yes
Introducing Memory Infineon Technologies CY7C1313BV18-167BZC from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:165, Mounting Type:Surface Mount, Package / Case:165-LBGA, Operating Temperature:0°C~70°C TA, CY7C1313BV18-167BZC pinout, CY7C1313BV18-167BZC datasheet PDF, CY7C1313BV18-167BZC amp .Beyond Memory Infineon Technologies CY7C1313BV18-167BZC ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Infineon Technologies CY7C1313BV18-167BZC


Memory Infineon Technologies CY7C1313BV18-167BZC Overview

Introducing the Memory Infineon Technologies CY7C1313BV18-167BZC, a high-performance SRAM designed to meet the rigorous demands of advanced computing and high-speed networking environments. This integrated circuit is engineered by Infineon Technologies, a leader in semiconductor innovation, ensuring reliability and cutting-edge technology. With a substantial 18Mbit capacity and a compact 165FBGA package, this memory component offers a robust solution for applications requiring fast access and large storage capacity in a minimal footprint. Its parallel interface ensures efficient data handling, making it an ideal choice for systems that demand high-speed memory operations.

CY7C1313BV18-167BZC Features

The CY7C1313BV18-167BZC features include an 18Mbit storage capacity which is essential for handling large datasets and complex algorithms. The parallel interface of the IC enhances data throughput and speed, critical for high-performance computing and real-time applications. Packaged in a compact 165FBGA, it optimizes board space and improves thermal management, suitable for dense electronic environments.

CY7C1313BV18-167BZC Applications

  • Networking Equipment: Utilized in routers, switches, and other network infrastructure to manage data buffers efficiently and improve throughput.
  • High-Performance Computing: Supports processing in supercomputers and server farms where large amounts of data access and high-speed processing are required.
  • Telecommunications: Essential in telecommunications infrastructure for fast data transmission and signal processing capabilities.
  • Automotive Electronics: Used in advanced driver-assistance systems (ADAS) to handle rapid sensor data processing for real-time decision making.
  • Industrial Automation: Enhances control systems in automated manufacturing processes by providing fast data access and storage, leading to increased efficiency and reliability.
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Shipping Cost

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