CY7C1312KV18-333BZC

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Mfr.Part #
CY7C1312KV18-333BZC
Manufacturer
Infineon Technologies
Package / Case
165-LBGA
Datasheet
Download
Description
IC SRAM 18MBIT PARALLEL 165FBGA
Stock
17,723
In Stock :
17,723

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Manufacturer :
Infineon Technologies
Product Category :
Memory
Pin Count :
165
Clock Frequency :
333MHz
JESD-609 Code :
e0
Length :
15mm
Number of Pins :
165
Nominal Supply Current :
690mA
Height Seated (Max) :
1.4mm
Mounting Type :
Surface Mount
I/O Type :
Separate
Voltage - Supply :
1.7V~1.9V
Memory Size :
18Mb 1M x 18
Number of Terminations :
165
Packaging :
Tray
Memory Interface :
Parallel
Address Bus Width :
19b
Peak Reflow Temperature (Cel) :
235
Additional Feature :
PIPELINED ARCHITECTURE
Density :
18 Mb
Published :
2003
Terminal Finish :
Tin/Lead (Sn/Pb)
Organization :
1MX18
Sync/Async :
SYNCHRONOUS
Number of Functions :
1
Memory Width :
18
Supply Voltage :
1.8V
Mount :
Surface Mount
RoHS Status :
Non-RoHS Compliant
Operating Supply Voltage :
1.8V
Factory Lead Time :
13 Weeks
Operating Temperature :
0°C~70°C TA
Memory Type :
Volatile
Access Time :
450 ps
Standby Voltage-Min :
1.7V
Radiation Hardening :
No
Memory Format :
SRAM
Terminal Position :
BOTTOM
Terminal Pitch :
1mm
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Word Size :
18b
Output Characteristics :
3-STATE
Package / Case :
165-LBGA
Time@Peak Reflow Temperature-Max (s) :
20
Base Part Number :
CY7C1312
Number of Ports :
2
Supply Voltage-Max (Vsup) :
1.9V
Supply Voltage-Min (Vsup) :
1.7V
Introducing Memory Infineon Technologies CY7C1312KV18-333BZC from Chip IC,where excellence meets affordability. This product stands out with its Number of Pins:165, Mounting Type:Surface Mount, Number of Terminations:165, Operating Temperature:0°C~70°C TA, Package / Case:165-LBGA, Base Part Number:CY7C1312, CY7C1312KV18-333BZC pinout, CY7C1312KV18-333BZC datasheet PDF, CY7C1312KV18-333BZC amp .Beyond Memory Infineon Technologies CY7C1312KV18-333BZC ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Infineon Technologies CY7C1312KV18-333BZC


Memory Infineon Technologies CY7C1312KV18-333BZC Overview

Introducing the CY7C1312KV18-333BZC from Infineon Technologies, a state-of-the-art Memory component that is engineered to meet the rigorous demands of high-performance data storage and processing applications. This integrated circuit (IC) boasts a robust 18Mbit SRAM capacity, housed in a compact 165FBGA package, making it an ideal solution for advanced systems requiring high-speed, reliable memory storage. The Memory Infineon Technologies CY7C1312KV18-333BZC is designed to deliver exceptional speed and reliability, addressing the critical needs of complex digital systems by facilitating swift data access and high throughput.

CY7C1312KV18-333BZC Features

The CY7C1312KV18-333BZC IC features include its large 18Mbit storage capacity and a high-speed parallel interface, ensuring rapid data handling capabilities essential for modern applications. Its compact 165FBGA packaging is specifically designed for efficient space utilization on printed circuit boards, making it particularly beneficial for densely packed electronic assemblies. Furthermore, this SRAM component offers stable operation under extended industrial temperature ranges, supporting its use in a variety of challenging environmental conditions.

CY7C1312KV18-333BZC Applications

  • Networking Equipment: Utilized in routers and switches for buffering and high-speed data caching, enhancing overall network efficiency.
  • Telecommunication Systems: Employs in telecom infrastructure to manage real-time signal processing tasks, crucial for maintaining seamless communication channels.
  • Automotive Electronics: Integrated into automotive systems for fast data processing and storage, critical for advanced driver-assistance systems (ADAS) and other in-vehicle networks.
  • Industrial Automation: Serves as a reliable memory solution in automation controllers and real-time systems, facilitating improved process control and operational reliability.
  • Medical Devices: Applied in medical imaging systems, aiding in the rapid and precise handling of large amounts of diagnostic data, critical for effective patient care and treatment.
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