CY7C1312CV18-200BZC

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Mfr.Part #
CY7C1312CV18-200BZC
Manufacturer
Infineon Technologies
Package / Case
165-LBGA
Datasheet
Download
Description
IC SRAM 18MBIT PARALLEL 165FBGA
Stock
2
In Stock :
2

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Manufacturer :
Infineon Technologies
Product Category :
Memory
Width :
13mm
Access Time :
450 ps
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Memory Width :
18
Packaging :
Tray
ECCN Code :
3A991.B.2.A
Surface Mount :
yes
Height Seated (Max) :
1.4mm
Memory Size :
18Mb 1M x 18
Operating Supply Voltage :
1.8V
Supply Voltage-Max (Vsup) :
1.9V
Mounting Type :
Surface Mount
Memory Format :
SRAM
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Standby Current-Max :
0.38A
Length :
15mm
Output Characteristics :
3-STATE
Package / Case :
165-LBGA
Terminal Finish :
Tin/Lead (Sn/Pb)
Clock Frequency :
200MHz
HTS Code :
8542.32.00.41
Published :
2003
Organization :
1MX18
Supply Voltage :
1.8V
JESD-609 Code :
e0
Number of Pins :
165
Pin Count :
165
Reach Compliance Code :
not_compliant
Qualification Status :
Not Qualified
Standby Voltage-Min :
1.7V
Density :
18 Mb
Base Part Number :
CY7C1312
Voltage - Supply :
1.7V~1.9V
RoHS Status :
Non-RoHS Compliant
Additional Feature :
PIPELINED ARCHITECTURE
Number of Terminations :
165
Peak Reflow Temperature (Cel) :
220
Memory Interface :
Parallel
Number of Functions :
1
I/O Type :
Separate
Terminal Pitch :
1mm
Memory Type :
Volatile
Supply Voltage-Min (Vsup) :
1.7V
Lead Free :
Contains Lead
Operating Temperature :
0°C~70°C TA
Supply Current-Max :
0.675mA
Terminal Position :
BOTTOM
Introducing Memory Infineon Technologies CY7C1312CV18-200BZC from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Package / Case:165-LBGA, Number of Pins:165, Base Part Number:CY7C1312, Number of Terminations:165, Operating Temperature:0°C~70°C TA, CY7C1312CV18-200BZC pinout, CY7C1312CV18-200BZC datasheet PDF, CY7C1312CV18-200BZC amp .Beyond Memory Infineon Technologies CY7C1312CV18-200BZC ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Infineon Technologies CY7C1312CV18-200BZC


Memory Infineon Technologies CY7C1312CV18-200BZC Overview

The Memory Infineon Technologies CY7C1312CV18-200BZC is an advanced 18Mbit SRAM component engineered by Infineon Technologies, tailored for high-speed, reliable performance in critical applications. This IC is housed in a compact 165FBGA package, designed to meet the stringent demands of contemporary digital systems. With its parallel interface, this SRAM module offers exceptional data integrity and speed, making it an ideal solution for designers looking to enhance system performance while maintaining a low power footprint.

CY7C1312CV18-200BZC Features

This SRAM device boasts a dense 18Mbit storage capacity, facilitating efficient data management in complex applications without compromising on performance. Its parallel interface ensures robust communication and fast data transfer rates. The 165FBGA package is not only space-efficient but also conducive to improved thermal management and reduced electromagnetic interference, providing a reliable basis for high-performance electronics design.

CY7C1312CV18-200BZC Applications

  • Networking Equipment: Utilized in routers and switches, enhancing cache memory to manage high-speed data transmissions and signal integrity.
  • Telecommunications: Serves in telecommunications infrastructure, supporting error correction and buffering to maintain consistent data flow and service reliability.
  • Automotive Electronics: Employed in advanced driver-assistance systems (ADAS) to process real-time sensor data, ensuring rapid response times and system reliability.
  • Industrial Automation: Critical in managing operational data in real-time control systems, aiding in process optimization and equipment monitoring for industrial applications.
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