CY7C1311CV18-250BZC

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Mfr.Part #
CY7C1311CV18-250BZC
Manufacturer
Infineon Technologies
Package / Case
165-LBGA
Datasheet
Download
Description
IC SRAM 18MBIT PARALLEL 165FBGA
Stock
22,474
In Stock :
22,474

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Manufacturer :
Infineon Technologies
Product Category :
Memory
Operating Temperature :
0°C~70°C TA
Package / Case :
165-LBGA
Terminal Pitch :
1mm
Supply Voltage-Min (Vsup) :
1.7V
Width :
13mm
Additional Feature :
PIPELINED ARCHITECTURE
Pin Count :
165
Qualification Status :
COMMERCIAL
Supply Voltage :
1.8V
Access Time (Max) :
0.45 ns
Supply Voltage-Max (Vsup) :
1.9V
Mounting Type :
Surface Mount
RoHS Status :
Non-RoHS Compliant
Packaging :
Tray
Memory Density :
16777216 bit
Voltage - Supply :
1.7V~1.9V
Memory Interface :
Parallel
Height Seated (Max) :
1.4mm
Organization :
2MX8
Reach Compliance Code :
Unknown
Number of Terminations :
165
JESD-30 Code :
R-PBGA-B165
Memory Width :
8
Surface Mount :
yes
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Memory Type :
Volatile
Length :
15mm
Memory Size :
18Mb 2M x 8
Clock Frequency :
250MHz
Terminal Position :
BOTTOM
Memory Format :
SRAM
Number of Functions :
1
Introducing Memory Infineon Technologies CY7C1311CV18-250BZC from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C~70°C TA, Package / Case:165-LBGA, Mounting Type:Surface Mount, Number of Terminations:165, CY7C1311CV18-250BZC pinout, CY7C1311CV18-250BZC datasheet PDF, CY7C1311CV18-250BZC amp .Beyond Memory Infineon Technologies CY7C1311CV18-250BZC ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Infineon Technologies CY7C1311CV18-250BZC


Memory Infineon Technologies CY7C1311CV18-250BZC Overview

The Memory Infineon Technologies CY7C1311CV18-250BZC is a high-performance 18Mbit SRAM component designed to meet the rigorous demands of advanced computing and high-speed data processing systems. Manufactured by Infineon Technologies, this IC offers reliable, fast, and versatile solutions for a broad array of applications that require optimal memory performance and low latency. The CY7C1311CV18-250BZC, housed in a compact 165FBGA package, is particularly suited for applications that demand high-speed data buffering and storage, making it an excellent choice for businesses looking to enhance their technology infrastructure with cutting-edge memory solutions.

CY7C1311CV18-250BZC Features

This IC SRAM from Infineon Technologies offers several key features that make it a standout choice for integration in sophisticated electronics systems. Key features include a parallel interface for rapid data access and transfer, a large 18Mbit capacity for substantial data storage, and a compact 165FBGA packaging that ensures a minimal footprint on system boards. These characteristics are critical for achieving the high-speed performance and reliability required in modern electronic devices.

CY7C1311CV18-250BZC Applications

  • High-Performance Computing: Utilized in server and workstation memory modules, where fast access to large amounts of data is crucial.
  • Networking Equipment: Serves as a buffer memory in switches and routers, enhancing the speed and efficiency of data transmission.
  • Telecommunications: Deployed in telecom infrastructure, aiding in the rapid handling and processing of communication data.
  • Automotive Electronics: Used in advanced driver-assistance systems (ADAS) to process real-time data from vehicle sensors.
  • Industrial Automation: Helps in managing complex processes and operations with real-time data collection and analysis.
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