CY7C1303BV25-167BZC

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Mfr.Part #
CY7C1303BV25-167BZC
Manufacturer
Infineon Technologies
Package / Case
165-LBGA
Datasheet
Download
Description
IC SRAM 18MBIT PARALLEL 165FBGA
Stock
17,924
In Stock :
17,924

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Manufacturer :
Infineon Technologies
Product Category :
Memory
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Supplier Device Package :
165-FBGA (13x15)
Memory Format :
SRAM
Packaging :
Tray
Memory Type :
Volatile
Memory Interface :
Parallel
Voltage - Supply :
2.4V~2.6V
Package / Case :
165-LBGA
Operating Temperature :
0°C~70°C TA
Memory Size :
18Mb 1M x 18
RoHS Status :
Non-RoHS Compliant
Mounting Type :
Surface Mount
Clock Frequency :
167MHz
Introducing Memory Infineon Technologies CY7C1303BV25-167BZC from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:165-LBGA, Operating Temperature:0°C~70°C TA, Mounting Type:Surface Mount, CY7C1303BV25-167BZC pinout, CY7C1303BV25-167BZC datasheet PDF, CY7C1303BV25-167BZC amp .Beyond Memory Infineon Technologies CY7C1303BV25-167BZC ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Infineon Technologies CY7C1303BV25-167BZC


Memory Infineon Technologies CY7C1303BV25-167BZC Overview

The Memory Infineon Technologies CY7C1303BV25-167BZC is a high-performance 18Mbit SRAM module designed by Infineon Technologies. This product is engineered to meet the demanding specifications of advanced computing systems, offering a robust storage solution with exceptional reliability and speed. The CY7C1303BV25-167BZC operates on a parallel interface, housed in a compact 165FBGA package, making it an ideal choice for applications requiring high-speed data access and substantial memory capacity without compromising on physical space.

CY7C1303BV25-167BZC Features

This 18Mbit SRAM boasts a parallel interface for rapid data transmission and operates at a speed grade of 167MHz, which facilitates quick access times and enhances overall system efficiency. Its 165FBGA packaging is designed for optimal space utilization and thermal management, ensuring reliable performance under varied environmental conditions.

CY7C1303BV25-167BZC Applications

  • High-Performance Computing: Utilized in servers and workstations where speed and reliability are crucial. This SRAM enables faster data fetching and storage, significantly enhancing computing capabilities.
  • Networking Equipment: Essential for routers and switches, where rapid data buffer management is needed to maintain high-speed network communications.
  • Telecommunications: Deployed in telecom infrastructure to support fast and reliable data transmission and processing.
  • Aerospace and Defense: Suitable for applications that require rugged, high-density memory solutions that can perform under extreme conditions without data integrity issues.
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Shipping Cost

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