CY7C1302DV25-167BZC

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Mfr.Part #
CY7C1302DV25-167BZC
Manufacturer
Infineon Technologies
Package / Case
165-LBGA
Datasheet
Download
Description
IC SRAM 9MBIT PARALLEL 165FBGA
Stock
35,685
In Stock :
35,685

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Manufacturer :
Infineon Technologies
Product Category :
Memory
Mounting Type :
Surface Mount
Packaging :
Tray
Memory Type :
Volatile
Memory Interface :
Parallel
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Clock Frequency :
167MHz
Operating Temperature :
0°C~70°C TA
Memory Size :
9Mb 512K x 18
Supplier Device Package :
165-FBGA (13x15)
Voltage - Supply :
2.4V~2.6V
RoHS Status :
Non-RoHS Compliant
Memory Format :
SRAM
Package / Case :
165-LBGA
Introducing Memory Infineon Technologies CY7C1302DV25-167BZC from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Operating Temperature:0°C~70°C TA, Package / Case:165-LBGA, CY7C1302DV25-167BZC pinout, CY7C1302DV25-167BZC datasheet PDF, CY7C1302DV25-167BZC amp .Beyond Memory Infineon Technologies CY7C1302DV25-167BZC ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Infineon Technologies CY7C1302DV25-167BZC


Memory Infineon Technologies CY7C1302DV25-167BZC Overview

The Memory Infineon Technologies CY7C1302DV25-167BZC is a high-performance 9Mbit SRAM module designed by Infineon Technologies, offering robust parallel interface capabilities encased in a compact 165FBGA package. This product stands out in the market for its exceptional reliability and speed, tailored for applications requiring rapid access to large volumes of data. With its advanced architecture, the CY7C1302DV25-167BZC ensures low-latency data retrieval and high bandwidth capabilities, making it an ideal choice for sophisticated electronics that demand efficient memory management and operational speed.

CY7C1302DV25-167BZC Features

The CY7C1302DV25-167BZC boasts several key features that make it a top contender in its category:

  • 9Mbit storage capacity ensuring ample space for critical data.
  • Parallel interface for swift data transfer rates.
  • 165-pin Fine Ball Grid Array (FBGA) package for reduced space and enhanced reliability.
  • High-speed operation and reduced latency for improved overall system performance.
  • Durable design suitable for demanding industrial applications.

CY7C1302DV25-167BZC Applications

  • Telecommunications equipment: Utilized in routers and switches for buffer memory, enhancing data flow management and reducing packet loss.
  • Networking hardware: Acts as cache memory in network interface cards (NICs) and modems, facilitating faster data processing and transmission.
  • Automotive electronics: Employed in advanced driver-assistance systems (ADAS) to handle real-time processing of sensor data, improving response times and vehicle safety.
  • Industrial automation: Used in PLC systems to manage process control data, ensuring high-speed access and reliable operation under various industrial conditions.
  • Consumer electronics: Integral to gaming consoles and high-performance computers for fast access to temporary data, thereby enhancing user experience through reduced loading times.
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Payment Method

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IMPORTANT NOTICE

You may place an order without registering to 1. You'll receive an order confirmations by e-mail soon . (Please remember to check the spam box if you didn't hear from us). 2. Since stock availability and prices may change at any time, the sales will reconfirm the order details and update you at soonest time.

Shipping Method

Most of our products are shipped via FEDEX,DHL,UPS and SF EXPRESS...

Shipping Cost

Shipping Cost starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).If customer have shipping account, we can make shipment under customer’s shipping account with freight collect directly.

The basic freight (for package ≤0.5 KG ) depends on the time zones and countries

Delivery Time

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