CY7C1270V18-375BZI

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Mfr.Part #
CY7C1270V18-375BZI
Manufacturer
Infineon Technologies
Package / Case
165-LBGA
Datasheet
Download
Description
IC SRAM 36MBIT PARALLEL 165FBGA
Stock
38,829
In Stock :
38,829

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Manufacturer :
Infineon Technologies
Product Category :
Memory
Memory Format :
SRAM
Surface Mount :
yes
Power Supplies :
1.5/1.81.8V
Memory Type :
Volatile
Package / Case :
165-LBGA
Operating Temperature :
-40°C~85°C TA
Length :
17mm
Height Seated (Max) :
1.4mm
ECCN Code :
3A991.B.2.A
Terminal Pitch :
1mm
Clock Frequency :
375MHz
Mounting Type :
Surface Mount
HTS Code :
8542.32.00.41
Qualification Status :
Not Qualified
Reach Compliance Code :
not_compliant
Supply Voltage-Max (Vsup) :
1.9V
Supply Voltage-Min (Vsup) :
1.7V
Output Characteristics :
3-STATE
JESD-30 Code :
R-PBGA-B165
Supply Voltage :
1.8V
Memory Density :
37748736 bit
Peak Reflow Temperature (Cel) :
220
RoHS Status :
Non-RoHS Compliant
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Width :
15mm
Memory Width :
36
Access Time (Max) :
0.45 ns
Pin Count :
165
Additional Feature :
PIPELINED ARCHITECTURE
Supply Current-Max :
1.21mA
Number of Terminations :
165
Terminal Position :
BOTTOM
Standby Voltage-Min :
1.7V
Memory Interface :
Parallel
Base Part Number :
CY7C1270
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Organization :
1MX36
JESD-609 Code :
e0
Memory Size :
36Mb 1M x 36
Standby Current-Max :
0.32A
Published :
2004
Number of Functions :
1
I/O Type :
COMMON
Terminal Finish :
TIN LEAD
Voltage - Supply :
1.7V~1.9V
Packaging :
Tray
Introducing Memory Infineon Technologies CY7C1270V18-375BZI from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:165-LBGA, Operating Temperature:-40°C~85°C TA, Mounting Type:Surface Mount, Number of Terminations:165, Base Part Number:CY7C1270, CY7C1270V18-375BZI pinout, CY7C1270V18-375BZI datasheet PDF, CY7C1270V18-375BZI amp .Beyond Memory Infineon Technologies CY7C1270V18-375BZI ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Infineon Technologies CY7C1270V18-375BZI


Memory Infineon Technologies CY7C1270V18-375BZI Overview

The Memory Infineon Technologies CY7C1270V18-375BZI is a high-performance SRAM component designed to meet the advanced requirements of modern digital systems. This integrated circuit boasts a significant storage capacity of 36Mbit, delivered through a parallel interface encapsulated in a compact 165FBGA package. Engineered by Infineon Technologies, a leader in semiconductor solutions, this SRAM is optimized for high-speed, reliable performance, making it an ideal choice for applications requiring rapid access to large volumes of data. The integration of this memory module into your systems ensures not only enhanced performance but also superior reliability and stability in demanding operational environments.

CY7C1270V18-375BZI Features

This integrated circuit comes with a robust set of features designed for flexible and reliable performance in complex applications. Key features include a large 36Mbit storage capacity, a fast access speed due to its parallel interface, and the use of advanced 165FBGA packaging technology for improved thermal management and reduced footprint on system boards. Its reliability is further enhanced by Infineon's cutting-edge manufacturing processes, which ensure high durability and operational longevity under various environmental conditions.

CY7C1270V18-375BZI Applications

  • Networking Equipment: Utilized in routers and switches, the CY7C1270V18-375BZI helps manage data flow efficiently, ensuring high-speed data access and buffering.
  • Telecommunications: In telecom infrastructures, this SRAM is essential for handling large volumes of data transfers and real-time communication processing.
  • Automotive Systems: Supports advanced automotive applications such as in-vehicle infotainment systems and driver assistance systems, where rapid data access is crucial.
  • Industrial Automation: Plays a key role in automated control systems for real-time processing and machine-to-machine communication in manufacturing environments.
  • High-performance Computing: Ideal for applications requiring high-speed, high-volume data handling, such as in servers and data centers.
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