CY7C1265V18-400BZC

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Mfr.Part #
CY7C1265V18-400BZC
Manufacturer
Infineon Technologies
Package / Case
165-LBGA
Datasheet
Download
Description
IC SRAM 36MBIT PARALLEL 165FBGA
Stock
43,986
In Stock :
43,986

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Manufacturer :
Infineon Technologies
Product Category :
Memory
Memory Interface :
Parallel
Clock Frequency :
400MHz
Package / Case :
165-LBGA
Memory Size :
36Mb 1M x 36
Packaging :
Tray
Mounting Type :
Surface Mount
Memory Type :
Volatile
RoHS Status :
Non-RoHS Compliant
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Voltage - Supply :
1.7V~1.9V
Memory Format :
SRAM
Supplier Device Package :
165-FBGA (15x17)
Operating Temperature :
0°C~70°C TA
Introducing Memory Infineon Technologies CY7C1265V18-400BZC from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:165-LBGA, Mounting Type:Surface Mount, Operating Temperature:0°C~70°C TA, CY7C1265V18-400BZC pinout, CY7C1265V18-400BZC datasheet PDF, CY7C1265V18-400BZC amp .Beyond Memory Infineon Technologies CY7C1265V18-400BZC ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Infineon Technologies CY7C1265V18-400BZC


Memory Infineon Technologies CY7C1265V18-400BZC Overview

The Memory Infineon Technologies CY7C1265V18-400BZC is a cutting-edge IC SRAM device, offering a robust 36Mbit capacity tailored for high-performance applications requiring rapid access to large volumes of data. This memory module utilizes a parallel interface, encapsulated in a compact 165FBGA package, making it ideal for streamlined integration into advanced electronic systems. Its design emphasizes reliability and speed, suitable for enterprises aiming to enhance their technological infrastructure. The professional design and capabilities of the CY7C1265V18-400BZC make it a prime choice for businesses looking to invest in top-tier memory solutions.

CY7C1265V18-400BZC Features

This SRAM module features a 36Mbit storage capacity with a parallel interface, ensuring quick data access and processing capabilities. The 165FBGA packaging not only offers a reduction in space required on printed circuit boards but also aids in better thermal management and reduced power consumption. These features collectively enhance the overall efficiency and performance of the device in demanding operational environments.

CY7C1265V18-400BZC Applications

  • Advanced Computing Systems: Utilized in server farms and data centers for fast data retrieval and high-speed operations critical in managing large databases and real-time processing applications.
  • Networking Equipment: Acts as high-speed buffer memory in routers and switches, enhancing bandwidth capability and reducing latency in network communications.
  • Telecommunications: Employed in telecommunications infrastructure to manage data flow and signal processing quickly and efficiently, supporting enhanced communication services.
  • Industrial Automation: Integral in complex industrial machinery for real-time control and processing, ensuring precise operations and system reliability.
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Shipping Cost

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