CY7C1263V18-400BZC

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Mfr.Part #
CY7C1263V18-400BZC
Manufacturer
Infineon Technologies
Package / Case
165-LBGA
Datasheet
Download
Description
IC SRAM 36MBIT PARALLEL 165FBGA
Stock
5
In Stock :
5

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Manufacturer :
Infineon Technologies
Product Category :
Memory
Supplier Device Package :
165-FBGA (15x17)
Operating Temperature :
0°C~70°C TA
Mounting Type :
Surface Mount
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Memory Format :
SRAM
Memory Interface :
Parallel
Memory Type :
Volatile
Clock Frequency :
400MHz
Packaging :
Tray
RoHS Status :
Non-RoHS Compliant
Voltage - Supply :
1.7V~1.9V
Package / Case :
165-LBGA
Memory Size :
36Mb 4M x 8
Introducing Memory Infineon Technologies CY7C1263V18-400BZC from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C~70°C TA, Mounting Type:Surface Mount, Package / Case:165-LBGA, CY7C1263V18-400BZC pinout, CY7C1263V18-400BZC datasheet PDF, CY7C1263V18-400BZC amp .Beyond Memory Infineon Technologies CY7C1263V18-400BZC ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Infineon Technologies CY7C1263V18-400BZC


Memory Infineon Technologies CY7C1263V18-400BZC Overview

The Infineon Technologies CY7C1263V18-400BZC is a high-performance 36Mbit SRAM component, packaged in a compact 165FBGA format. This Memory class integrated circuit offers robust parallel interface capabilities, making it ideal for applications demanding high-speed data access and substantial storage capacity. The incorporation of advanced design techniques ensures reliability and high-speed performance, positioning it as a key component for B2B customers looking to enhance system capabilities in demanding environments.

CY7C1263V18-400BZC Features

This SRAM module provides several standout features essential for modern high-performance computing and industrial applications, including a fast access time of 400MHz. The low-power operation coupled with a dense 165-pin FBGA package allows for efficient space utilization in complex PCB layouts, ensuring that system designers can meet stringent size and power requirements without compromising on memory capacity or speed.

CY7C1263V18-400BZC Applications

  • Networking Equipment: Utilized in routers and switches for packet buffering, ensuring fast and efficient data handling.
  • High-Performance Computing: Provides the necessary speed and capacity for temporary data storage in computational simulations and data analysis.
  • Telecommunications: Used in telecom infrastructure to support high-speed data transmission and signal processing tasks.
  • Industrial Automation: Facilitates complex machine control operations by offering rapid access to data, enhancing process efficiency and reliability.
  • Aerospace and Defense: Meets the rigorous demands of aerospace systems and military hardware for quick, reliable data access under extreme conditions.
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Shipping Cost

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