CY7C1069G30-10ZSXI
- Mfr.Part #
- CY7C1069G30-10ZSXI
- Manufacturer
- Infineon Technologies
- Package / Case
- 54-TSOP (0.400, 10.16mm Width)
- Datasheet
- Download
- Description
- IC SRAM 16MBIT PAR 54TSOP II
- Stock
- 586
- In Stock :
- 586
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Memory
- Access Time (Max) :
- 10 ns
- Surface Mount :
- yes
- Supply Voltage-Min (Vsup) :
- 2.2V
- Memory Density :
- 16777216 bit
- JESD-609 Code :
- e3
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Memory Type :
- Volatile
- Write Cycle Time - Word, Page :
- 10ns
- ECCN Code :
- 3A991.B.2.A
- Operating Temperature :
- -40°C~85°C TA
- Supply Voltage-Max (Vsup) :
- 3.6V
- Memory Size :
- 16Mb 2M x 8
- JESD-30 Code :
- R-PDSO-G54
- Number of Functions :
- 1
- Lead Free :
- Lead Free
- RoHS Status :
- ROHS3 Compliant
- HTS Code :
- 8542.32.00.41
- Peak Reflow Temperature (Cel) :
- 260
- Factory Lead Time :
- 13 Weeks
- Width :
- 10.16mm
- Voltage - Supply :
- 2.2V~3.6V
- Terminal Position :
- Dual
- Supply Voltage :
- 3V
- Length :
- 22.415mm
- Terminal Pitch :
- 0.8mm
- Mounting Type :
- Surface Mount
- Memory Width :
- 8
- Memory Format :
- SRAM
- Organization :
- 2MX8
- Height Seated (Max) :
- 1.2mm
- Package / Case :
- 54-TSOP (0.400, 10.16mm Width)
- Packaging :
- Tray
- Published :
- 2012
- Terminal Finish :
- Tin (Sn)
- Memory Interface :
- Parallel
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Number of Terminations :
- 54
- Datasheets
- CY7C1069G30-10ZSXI

Memory Infineon Technologies CY7C1069G30-10ZSXI Overview
The Infineon Technologies CY7C1069G30-10ZSXI is a high-performance IC SRAM that provides a substantial 16Mbit of storage capacity, housed in a 54-pin TSOP II package. Designed for applications requiring fast access and high reliability, this SRAM (Static Random Access Memory) offers an ideal solution for advanced computing and industrial applications. The Memory Infineon Technologies CY7C1069G30-10ZSXI utilizes advanced manufacturing technology to ensure durability and optimal performance, making it an excellent choice for manufacturers looking to integrate robust memory systems into their designs.
CY7C1069G30-10ZSXI Features
This SRAM chip boasts several features that make it stand out in the electronics market. It supports a parallel interface for high-speed data transfer, which is crucial for systems requiring quick access to large amounts of data. The robust TSOP II package ensures mechanical stability and enhanced thermal characteristics, essential for maintaining integrity and performance under varying environmental conditions. Additionally, the device operates at 10ns, providing the rapid response needed for high-performance computing and critical applications.
CY7C1069G30-10ZSXI Applications
- Advanced Computing Systems: Utilized in server and high-performance computing applications where speed and reliability are paramount. The fast access time facilitates efficient data processing and management.
- Networking Equipment: Ideal for use in routers and switches that require high-speed memory for buffer and caching functions, helping to manage data flow efficiently.
- Automotive Electronics: Supports automotive applications such as advanced driver-assistance systems (ADAS) where quick data retrieval is necessary for real-time decision making.
- Industrial Automation: Applied in PLCs and industrial computing systems to enhance process control and operational efficiency with its high-speed data access and reliability.
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