CY62127DV30LL-55BVI

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Mfr.Part #
CY62127DV30LL-55BVI
Manufacturer
Infineon Technologies
Package / Case
48-VFBGA
Datasheet
Download
Description
STANDARD SRAM, 64KX16, 55NS
Stock
1,713
In Stock :
1,713

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Manufacturer :
Infineon Technologies
Product Category :
Memory
Number of Terminals :
48
JESD-609 Code :
e0
Operating Mode :
ASYNCHRONOUS
Mounting Type :
Surface Mount
Package :
Bulk
JESD-30 Code :
R-PBGA-B48
Memory Format :
SRAM
Supply Voltage-Min (Vsup) :
2.2 V
Terminal Form :
Ball
Surface Mount :
yes
Pbfree Code :
No
Product Status :
Active
Parallel/Serial :
Parallel
Memory Width :
16
Manufacturer :
Rochester Electronics LLC
Base Product Number :
CY62127
Number of Words :
65536 words
Terminal Pitch :
0.75 mm
Memory Type :
Volatile
Pin Count :
48
Seated Height-Max :
1 mm
RoHS :
Compliant
Width :
6 mm
Terminal Finish :
TIN LEAD
Reach Compliance Code :
Unknown
Package / Case :
48-VFBGA
Memory Density :
1048576 bit
Organization :
64KX16
Qualification Status :
COMMERCIAL
Memory Interface :
Parallel
Length :
8 mm
Package Shape :
RECTANGULAR
Terminal Position :
BOTTOM
Supply Voltage-Max (Vsup) :
3.6 V
Temperature Grade :
Industrial
Access Time :
55 ns
Technology :
SRAM - Asynchronous
Memory Size :
1Mbit
Voltage - Supply :
2.2V ~ 3.6V
Memory IC Type :
STANDARD SRAM
Peak Reflow Temperature (Cel) :
240
Series :
MoBL®
Write Cycle Time - Word, Page :
55ns
Memory Organization :
64K x 16
Number of Functions :
1
Supplier Device Package :
48-VFBGA (6x8)
Operating Temperature :
-40°C ~ 85°C (TA)
Introducing Memory Infineon Technologies CY62127DV30LL-55BVI from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Package / Case:48-VFBGA, Operating Temperature:-40°C ~ 85°C (TA), CY62127DV30LL-55BVI pinout, CY62127DV30LL-55BVI datasheet PDF, CY62127DV30LL-55BVI amp .Beyond Memory Infineon Technologies CY62127DV30LL-55BVI ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Infineon Technologies CY62127DV30LL-55BVI


Memory Infineon Technologies CY62127DV30LL-55BVI Overview

Infineon Technologies presents the CY62127DV30LL-55BVI, a standard SRAM boasting a capacity of 64Kx16 and a rapid access time of 55ns. Engineered with cutting-edge technology, this memory module guarantees high performance and reliability, making it the ideal choice for demanding industrial applications.

CY62127DV30LL-55BVI Features

  • High Capacity: With a storage capacity of 64Kx16, this memory module offers ample space for data storage and retrieval.
  • Rapid Access Time: Featuring a swift access time of 55ns, users can expect lightning-fast data access, enhancing overall system performance.
  • Robust Design: Constructed with durability in mind, the CY62127DV30LL-55BVI is built to withstand harsh industrial environments, ensuring reliable operation under challenging conditions.
  • Low Power Consumption: Designed for energy efficiency, this memory module minimizes power consumption without compromising performance, making it an environmentally friendly solution.
  • Wide Temperature Range: Operating seamlessly across a wide temperature range, this memory module remains stable and dependable even in extreme environmental conditions.

CY62127DV30LL-55BVI Applications

  • Industrial Automation Systems: The CY62127DV30LL-55BVI is perfectly suited for industrial automation systems, where high performance, reliability, and durability are paramount. It facilitates seamless data processing and storage, ensuring smooth operation of machinery and equipment in industrial settings.
  • Communications Equipment: In communications equipment such as routers, switches, and networking devices, the CY62127DV30LL-55BVI plays a crucial role in facilitating data transmission and storage. Its rapid access time and robust design make it an ideal choice for ensuring reliable connectivity and performance.
  • Embedded Systems: Embedded systems rely on efficient memory solutions for storing program code and data. The CY62127DV30LL-55BVI provides the necessary storage capacity and fast access time required for embedded applications, enabling seamless operation of devices such as automotive electronics, medical devices, and consumer electronics.
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