C8120-04
- Mfr.Part #
- C8120-04
- Manufacturer
- Aries Electronics, Inc.
- Package / Case
- Datasheet
- Download
- Description
- CONN IC DIP SOCKET 20POS TIN
- Stock
- 11,355
- In Stock :
- 11,355
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- Manufacturer :
- Aries Electronics, Inc.
- Product Category :
- IC Sockets
- Type :
- DIP, 0.3 (7.62mm) Row Spacing
- JESD-609 Code :
- e3
- Housing Material :
- Polyamide (PA46), Nylon 4/6, Glass Filled
- Mating Contact Pitch :
- 0.1 inch
- RoHS Status :
- RoHS Compliant
- Operating Temperature :
- -55°C~105°C
- Number of Contacts :
- 20
- Termination :
- Wire Wrap
- ECCN Code :
- EAR99
- Contact Style :
- SQ PIN-SKT
- Contact Material - Mating :
- Phosphor Bronze
- Contact Finish Thickness - Mating :
- 200.0μin 5.08μm
- Height :
- 7.11mm
- Number of Pins :
- 20
- Body Breadth :
- 0.4 inch
- Dielectric Withstanding Voltage :
- 1000VAC V
- Material Flammability Rating :
- UL94 V-0
- Current Rating (Amps) :
- 1.5A
- Number of Positions or Pins (Grid) :
- 20 (2 x 10)
- PCB Contact Pattern :
- RECTANGULAR
- Contact Material - Post :
- Phosphor Bronze
- Contact Finish - Mating :
- Tin
- Pitch - Mating :
- 0.100 2.54mm
- Width :
- 10.2mm
- Additional Feature :
- STANDARD: UL 94V-0
- Body Depth :
- 0.28 inch
- Mount :
- Wire
- PCB Contact Row Spacing :
- 0.3 mm
- Contact Finish Thickness - Post :
- 200.0μin 5.08μm
- Length :
- 27.1mm
- Termination Post Length :
- 0.675 17.15mm
- Feature :
- Closed Frame
- Moisture Sensitivity Level (MSL) :
- Not Applicable
- Series :
- Edge-Grip™, C81
- Lead Free :
- Contains Lead
- Terminal Pitch :
- 2.54mm
- Mounting Type :
- Through Hole
- Insulation Resistance :
- 1000000000Ohm
- Contact Material :
- Bronze
- Published :
- 2009
- Pitch - Post :
- 0.100 2.54mm
- Packaging :
- Bulk
- Datasheets
- C8120-04

C8120-04 datasheet pdf and Sockets for ICs, Transistors product details from Aries Electronics stock available at Xinshop
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