BZX585-C7V5135

Manufacturer :

NXP Semiconductors

Product Category :

Specialized ICs

Mounting Type :

Surface Mount

Mount :

Surface Mount

Terminal Position :

Dual

Number of Terminations :

2

Power Dissipation :

300mW

Max Reverse Leakage Current :

1μA

HTS Code :

8541.10.00.50

Max Power Dissipation :

300mW

Published :

2010

Voltage - Forward (Vf) (Max) @ If :

1.1V @ 100mA

Peak Reflow Temperature (Cel) :

260

Impedance :

10Ohm

ESD Protection :

No

Zener Voltage :

7.505V

Packaging :

Tape and Reel (TR)

Polarity :

Unidirectional

Test Current :

5mA

Voltage Tol-Max :

5%

Element Configuration :

Single

Voltage Tolerance :

5%

Pin Count :

2

Number of Pins :

2

Operating Temperature :

-65°C~150°C

Terminal Form :

Flat

Reference Voltage :

7.5V

JESD-609 Code :

e3

Current - Reverse Leakage @ Vr :

1µA @ 5V

Diode Type :

ZENER DIODE

Number of Elements :

1

Diode Element Material :

SILICON

Voltage - Zener (Nom) (Vz) :

7.5V

Impedance-Max :

10Ohm

Tolerance :

±5%

Base Part Number :

BZX585C7V5

Factory Lead Time :

4 Weeks

ECCN Code :

EAR99

RoHS Status :

ROHS3 Compliant

Contact Plating :

Tin

Moisture Sensitivity Level (MSL) :

1 (Unlimited)

Time@Peak Reflow Temperature-Max (s) :

40

Package / Case :

SC-79, SOD-523