BZX585-C56,115

Manufacturer :

NXP Semiconductors

Product Category :

Unclassified

Diode Type :

ZENER DIODE

RoHS Status :

ROHS3 Compliant

Mounting Type :

Surface Mount

ESD Protection :

No

Polarity :

Unidirectional

Number of Terminations :

2

Diode Element Material :

SILICON

Tolerance :

±5%

Voltage Tol-Max :

5%

Current - Reverse Leakage @ Vr :

50nA @ 39.2V

Terminal Position :

Dual

Reference Voltage :

56V

Power Dissipation :

300mW

Impedance-Max :

200Ohm

Terminal Form :

Flat

Package / Case :

SC-79, SOD-523

Operating Temperature :

-65°C~150°C

Pin Count :

2

Zener Voltage :

56V

Packaging :

Tape and Reel (TR)

Time@Peak Reflow Temperature-Max (s) :

40

Base Part Number :

BZX585C56

Test Current :

2mA

Max Reverse Leakage Current :

50nA

JESD-609 Code :

e3

Moisture Sensitivity Level (MSL) :

1 (Unlimited)

Peak Reflow Temperature (Cel) :

260

Element Configuration :

Single

Mount :

Surface Mount

Impedance :

200Ohm

Voltage Tolerance :

5%

Max Power Dissipation :

300mW

Voltage - Forward (Vf) (Max) @ If :

1.1V @ 100mA

HTS Code :

8541.10.00.50

Contact Plating :

Tin

Number of Elements :

1

Number of Pins :

2

Factory Lead Time :

4 Weeks

ECCN Code :

EAR99