BZX585-C2V4135

Manufacturer :

NXP Semiconductors

Product Category :

Specialized ICs

Mount :

Surface Mount

Tolerance :

±5%

Impedance :

100Ohm

Max Power Dissipation :

300mW

Number of Terminations :

2

Number of Pins :

2

Moisture Sensitivity Level (MSL) :

1 (Unlimited)

Terminal Form :

Flat

Operating Temperature :

-65°C~150°C

Voltage Tolerance :

5%

Diode Element Material :

SILICON

Test Current :

5mA

Voltage Tol-Max :

5%

ESD Protection :

No

Power Dissipation :

300mW

Voltage - Forward (Vf) (Max) @ If :

1.1V @ 100mA

Diode Type :

ZENER DIODE

Package / Case :

SC-79, SOD-523

Element Configuration :

Single

Pin Count :

2

Zener Voltage :

2.4V

HTS Code :

8541.10.00.50

Current - Reverse Leakage @ Vr :

50μA @ 1V

Reference Voltage :

2.4V

Published :

2009

Contact Plating :

Tin

Mounting Type :

Surface Mount

Number of Elements :

1

Peak Reflow Temperature (Cel) :

260

Max Reverse Leakage Current :

50μA

Factory Lead Time :

4 Weeks

JESD-609 Code :

e3

Packaging :

Tape and Reel (TR)

Terminal Position :

Dual

RoHS Status :

ROHS3 Compliant

ECCN Code :

EAR99

Time@Peak Reflow Temperature-Max (s) :

40

Impedance-Max :

100Ohm

Polarity :

Unidirectional