BZV55-C4V7,115

Manufacturer :

NXP Semiconductors

Product Category :

Unclassified

Working Test Current :

5mA

Operating Temperature :

-65°C~200°C

Terminal Finish :

Tin (Sn)

Pin Count :

2

Surface Mount :

yes

Moisture Sensitivity Level (MSL) :

1 (Unlimited)

Max Junction Temperature (Tj) :

200°C

Terminal Form :

WRAP AROUND

Number of Elements :

1

Diode Type :

ZENER DIODE

Terminal Position :

END

Tolerance :

±5%

Reference Voltage :

4.7V

Forward Current :

250mA

Base Part Number :

BZV55C4V7

Time@Peak Reflow Temperature-Max (s) :

30

Number of Pins :

2

Impedance-Max :

80Ohm

Voltage Tol-Max :

5%

Factory Lead Time :

6 Weeks

Published :

2007

Reverse Voltage :

2V

Peak Reflow Temperature (Cel) :

260

Configuration :

Single

JESD-609 Code :

e3

Mounting Type :

Surface Mount

Polarity :

Unidirectional

Current - Reverse Leakage @ Vr :

3μA @ 2V

Package / Case :

DO-213AC, MINI-MELF, SOD-80

Diode Element Material :

SILICON

Voltage - Forward (Vf) (Max) @ If :

900mV @ 10mA

Zener Voltage :

4.7V

Case Connection :

Isolated

ECCN Code :

EAR99

Power Dissipation :

500mW

Packaging :

Tape and Reel (TR)

Number of Terminations :

2

Max Reverse Leakage Current :

3μA

RoHS Status :

ROHS3 Compliant

HTS Code :

8541.10.00.50

Height :

1.6mm