BZV55-C3V3,115

Manufacturer :

NXP Semiconductors

Product Category :

Unclassified

Voltage Tol-Max :

5%

Terminal Finish :

Tin (Sn)

Impedance-Max :

95Ohm

Working Test Current :

5mA

Polarity :

Unidirectional

Max Junction Temperature (Tj) :

200°C

Mounting Type :

Surface Mount

Case Connection :

Isolated

Surface Mount :

yes

Terminal Position :

END

Forward Current :

250mA

Voltage - Zener (Nom) (Vz) :

3.3V

Current - Reverse Leakage @ Vr :

5μA @ 1V

Pin Count :

2

Zener Voltage :

3.3V

Diode Type :

ZENER DIODE

Operating Temperature :

-65°C~200°C

Factory Lead Time :

6 Weeks

Moisture Sensitivity Level (MSL) :

1 (Unlimited)

HTS Code :

8541.10.00.50

Time@Peak Reflow Temperature-Max (s) :

30

Max Reverse Leakage Current :

5μA

Terminal Form :

WRAP AROUND

RoHS Status :

ROHS3 Compliant

Number of Elements :

1

Published :

2010

ECCN Code :

EAR99

Package / Case :

DO-213AC, MINI-MELF, SOD-80

Diode Element Material :

SILICON

Peak Reflow Temperature (Cel) :

260

Tolerance :

±5%

Voltage - Forward (Vf) (Max) @ If :

900mV @ 10mA

Base Part Number :

BZV55C3V3

Height :

1.6mm

JESD-609 Code :

e3

Packaging :

Tape and Reel (TR)

Configuration :

Single

Number of Pins :

2

Number of Terminations :

2

Power Dissipation :

500mW

Reference Voltage :

3.3V