BZV55-C2V4135

Manufacturer :

NXP Semiconductors

Product Category :

Specialized ICs

Impedance-Max :

100Ohm

RoHS Status :

ROHS3 Compliant

HTS Code :

8541.10.00.50

ESD Protection :

No

Packaging :

Tape and Reel (TR)

Terminal Position :

END

Number of Pins :

2

Test Current :

5mA

Voltage Tolerance :

5%

Operating Temperature :

-65°C~200°C

Number of Terminations :

2

Voltage - Forward (Vf) (Max) @ If :

900mV @ 10mA

Impedance :

100Ohm

Time@Peak Reflow Temperature-Max (s) :

30

Diode Element Material :

SILICON

ECCN Code :

EAR99

Peak Reflow Temperature (Cel) :

260

Max Power Dissipation :

500mW

JESD-609 Code :

e3

Reference Voltage :

2.4V

Package / Case :

DO-213AC, MINI-MELF, SOD-80

Zener Voltage :

2.4V

Diode Type :

ZENER DIODE

Mount :

Surface Mount

Max Reverse Leakage Current :

50μA

Pin Count :

2

Voltage Tol-Max :

5%

Factory Lead Time :

6 Weeks

Element Configuration :

Single

Moisture Sensitivity Level (MSL) :

1 (Unlimited)

Tolerance :

±5%

Current - Reverse Leakage @ Vr :

50μA @ 1V

Base Part Number :

BZV55C2V4

Terminal Form :

WRAP AROUND

Case Connection :

Isolated

Mounting Type :

Surface Mount

Power Dissipation :

500mW

Contact Plating :

Tin

Number of Elements :

1

Polarity :

Unidirectional