BZV55-C18,135

Manufacturer :

NXP Semiconductors

Product Category :

Unclassified

Base Part Number :

BZV55C18

Max Power Dissipation :

500mW

Impedance-Max :

45Ohm

Packaging :

Tape and Reel (TR)

Current - Reverse Leakage @ Vr :

50nA @ 12.6V

Number of Terminations :

2

Pin Count :

2

Polarity :

Unidirectional

Voltage - Forward (Vf) (Max) @ If :

900mV @ 10mA

Impedance :

45Ohm

Published :

2010

Number of Elements :

1

Operating Temperature :

-65°C~200°C

Max Reverse Leakage Current :

50nA

ECCN Code :

EAR99

Terminal Position :

END

Test Current :

5mA

Diode Element Material :

SILICON

Reference Voltage :

18V

Zener Voltage :

17.95V

Power Dissipation :

500mW

Time@Peak Reflow Temperature-Max (s) :

30

Element Configuration :

Single

Voltage - Zener (Nom) (Vz) :

18V

Mount :

Surface Mount

Diode Type :

ZENER DIODE

Package / Case :

DO-213AC, MINI-MELF, SOD-80

Contact Plating :

Tin

HTS Code :

8541.10.00.50

Peak Reflow Temperature (Cel) :

260

ESD Protection :

No

JESD-609 Code :

e3

Terminal Form :

WRAP AROUND

Mounting Type :

Surface Mount

Case Connection :

Isolated

Moisture Sensitivity Level (MSL) :

1 (Unlimited)

Number of Pins :

2

Factory Lead Time :

6 Weeks

Voltage Tol-Max :

5%

RoHS Status :

ROHS3 Compliant

Voltage Tolerance :

5%

Tolerance :

±5%