BZV55-C13,115

Manufacturer :

NXP Semiconductors

Product Category :

Unclassified

JESD-609 Code :

e3

Terminal Position :

END

Surface Mount :

yes

Voltage - Forward (Vf) (Max) @ If :

900mV @ 10mA

Case Connection :

Isolated

Time@Peak Reflow Temperature-Max (s) :

30

RoHS Status :

ROHS3 Compliant

Peak Reflow Temperature (Cel) :

260

Diode Element Material :

SILICON

Working Test Current :

5mA

Operating Temperature :

-65°C~200°C

Impedance-Max :

30Ohm

Base Part Number :

BZV55C13

HTS Code :

8541.10.00.50

Number of Pins :

2

Power Dissipation-Max :

0.4W

Voltage - Zener (Nom) (Vz) :

13V

Current - Reverse Leakage @ Vr :

100nA @ 8V

Published :

2010

ECCN Code :

EAR99

Reference Voltage :

13V

Terminal Form :

WRAP AROUND

Power - Max :

500mW

Factory Lead Time :

6 Weeks

Tolerance :

±5%

Number of Elements :

1

Terminal Finish :

Tin (Sn)

Package / Case :

DO-213AC, MINI-MELF, SOD-80

Pin Count :

2

Configuration :

Single

Diode Type :

ZENER DIODE

Voltage Tol-Max :

5%

Mounting Type :

Surface Mount

Packaging :

Tape and Reel (TR)

Polarity :

Unidirectional

Number of Terminations :

2

Moisture Sensitivity Level (MSL) :

1 (Unlimited)