BZA962AVL,115

Manufacturer :

NXP Semiconductors

Product Category :

Unclassified

Termination :

SMD/SMT

Mount :

Surface Mount

Depth :

1.3mm

RoHS Status :

ROHS3 Compliant

Breakdown Voltage :

5.89V

REACH SVHC :

No SVHC

Published :

2009

Direction :

Unidirectional

Applications :

GENERAL PURPOSE

Length :

1.7mm

ECCN Code :

EAR99

Lead Free :

Lead Free

Power Line Protection :

No

Terminal Position :

Dual

Operating Supply Voltage :

6.2V

Base Part Number :

BZA9*AVL

Non-rep Peak Rev Power Dis-Max :

6W

Max Breakdown Voltage :

6.51V

Min Operating Temperature :

-65°C

JESD-609 Code :

e3

Packaging :

Tape and Reel (TR)

Package / Case :

SOT-665

Pin Count :

5

Type :

Zener

Contact Plating :

Tin

Width :

6.35mm

Leakage Current :

100nA

Peak Pulse Current :

850mA

Mounting Type :

Surface Mount

Number of Terminations :

5

Clamping Voltage :

4V

Max Operating Temperature :

150°C

Weight :

4.535924g

Max Surge Current :

850mA

Number of Elements :

4

Height :

6.35mm

Number of Pins :

5

Power Dissipation :

300mW

Reverse Standoff Voltage :

6.2V

Moisture Sensitivity Level (MSL) :

1 (Unlimited)

Diode Element Material :

SILICON

Working Voltage :

6.51V

Capacitance @ Frequency :

18pF @ 1MHz

Peak Pulse Power :

6W

Terminal Form :

Flat

Max Power Dissipation :

15W

Min Breakdown Voltage :

5.89V

Factory Lead Time :

4 Weeks

Capacitance :

22pF