BYW29ED-200,118

Manufacturer :

NXP Semiconductors

Product Category :

Unclassified

Case Connection :

CATHODE

ECCN Code :

EAR99

Mounting Type :

Surface Mount

Speed :

Fast Recovery =< 500ns, > 200mA (Io)

Package / Case :

TO-252-3, DPak (2 Leads + Tab), SC-63

Peak Reflow Temperature (Cel) :

NOT SPECIFIED

Reach Compliance Code :

not_compliant

Moisture Sensitivity Level (MSL) :

1 (Unlimited)

Terminal Form :

Gull wing

Time@Peak Reflow Temperature-Max (s) :

NOT SPECIFIED

Voltage - DC Reverse (Vr) (Max) :

200V

Configuration :

Single

Packaging :

Tape and Reel (TR)

Forward Current :

8A

RoHS Status :

RoHS Compliant

JESD-609 Code :

e3

Number of Elements :

1

Terminal Position :

Single

Voltage - Forward (Vf) (Max) @ If :

1.3V @ 20A

Surface Mount :

yes

Reference Standard :

IEC-134

Base Part Number :

BYW29-200

Number of Phases :

1

Number of Terminations :

2

Operating Temperature (Max) :

150°C

Reverse Current-Max :

10μA

Operating Temperature - Junction :

150°C Max

Diode Element Material :

SILICON

Diode Type :

Standard

JESD-30 Code :

R-PSSO-G2

Current - Reverse Leakage @ Vr :

10µA @ 200V

Reverse Recovery Time :

25ns

Application :

ULTRA FAST SOFT RECOVERY

Rep Pk Reverse Voltage-Max :

200V

Terminal Finish :

Tin (Sn)