BU7244FV-E2

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Mfr.Part #
BU7244FV-E2
Manufacturer
ROHM Semiconductor
Package / Case
14-LSSOP (0.173, 4.40mm Width)
Datasheet
Download
Description
IC CMOS 4 CIRCUIT 14SSOPB
Stock
1,313
In Stock :
1,313

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Manufacturer :
ROHM Semiconductor
Product Category :
Instrumentation, OP Amps, Buffer Amps
Terminal Form :
Gull wing
Number of Functions :
4
Current - Input Bias :
1pA
Published :
2014
Factory Lead Time :
9 Weeks
Voltage - Supply, Single/Dual (±) :
1.8V~5.5V
Number of Terminations :
14
Output Current per Channel :
12mA
Mount :
Surface Mount
Slew Rate :
0.4V/µs
Supply Voltage Limit-Max :
7V
Amplifier Type :
CMOS
Packaging :
Tape and Reel (TR)
Number of Pins :
14
Operating Temperature :
-40°C~85°C
RoHS Status :
ROHS3 Compliant
Terminal Pitch :
0.65mm
Operating Supply Current :
360μA
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Package / Case :
14-LSSOP (0.173, 4.40mm Width)
Voltage - Input Offset :
1mV
Bandwidth :
900 kHz
Length :
5mm
Max Power Dissipation :
700mW
Mounting Type :
Surface Mount
Input Offset Voltage (Vos) :
1mV
Common Mode Rejection Ratio :
60 dB
Terminal Position :
Dual
ECCN Code :
EAR99
Unity Gain BW-Nom :
900 kHz
Height Seated (Max) :
1.35mm
Number of Circuits :
4
Supply Voltage :
3V
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Datasheets
BU7244FV-E2
Introducing Instrumentation, OP Amps, Buffer Amps ROHM Semiconductor BU7244FV-E2 from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:14, Number of Pins:14, Operating Temperature:-40°C~85°C, Package / Case:14-LSSOP (0.173, 4.40mm Width), Bandwidth:900 kHz, Mounting Type:Surface Mount, BU7244FV-E2 pinout, BU7244FV-E2 datasheet PDF, BU7244FV-E2 amp .Beyond Instrumentation, OP Amps, Buffer Amps ROHM Semiconductor BU7244FV-E2 ,we also offer OP07CDR, TS321CX5 RFG, NE5532ADR, Our vast inventory has you covered. Contact us now for immediate solutions.

ROHM Semiconductor BU7244FV-E2


Instrumentation, OP Amps, Buffer Amps ROHM Semiconductor BU7244FV-E2 Overview

ROHM Semiconductor's BU7244FV-E2 is an advanced integrated circuit designed for precise signal processing in instrumentation, operational amplifiers, and buffer amplifier applications. With its cutting-edge CMOS technology, this IC offers exceptional performance and reliability, making it ideal for demanding industrial and commercial environments.

Featuring a compact 14SSOPB package, the BU7244FV-E2 enables seamless integration into various electronic systems, providing engineers with flexibility and convenience during design and assembly processes. Whether used in medical devices, automotive systems, or industrial machinery, this versatile IC delivers consistent results and enhances overall system efficiency.

Engineered to meet the highest quality standards, the BU7244FV-E2 from ROHM Semiconductor empowers businesses to achieve precision, reliability, and innovation in their products, driving success in today's competitive markets.

BU7244FV-E2 Features

  • Advanced CMOS technology for precise signal processing
  • Compact 14SSOPB package for easy integration
  • High reliability and performance in demanding environments
  • Wide range of operating voltage and temperature
  • Low power consumption for energy-efficient designs
  • Robust protection features for enhanced durability

BU7244FV-E2 Applications

  • Medical Instruments: The BU7244FV-E2 is utilized in medical devices such as patient monitoring systems and diagnostic equipment to ensure accurate signal processing and reliable performance, enhancing patient care and safety.
  • Automotive Electronics: In automotive systems like engine control units (ECUs) and safety systems, this IC plays a critical role in signal conditioning and processing, enabling efficient operation and optimal vehicle performance.
  • Industrial Automation: Integrated into industrial machinery and automation systems, the BU7244FV-E2 facilitates precise control and monitoring of processes, improving productivity, and reducing downtime.
  • Communication Systems: From telecommunications infrastructure to data transmission equipment, this IC enhances signal integrity and efficiency, enabling seamless communication in diverse applications.
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