BR25G256F-3GE2

Manufacturer :

ROHM Semiconductor

Product Category :

Memory

Serial Bus Type :

SPI

Terminal Pitch :

1.27mm

RoHS Status :

ROHS3 Compliant

Surface Mount :

yes

Number of Functions :

1

Voltage - Supply :

1.6V~5.5V

Factory Lead Time :

10 Weeks

Peak Reflow Temperature (Cel) :

NOT SPECIFIED

Time@Peak Reflow Temperature-Max (s) :

NOT SPECIFIED

Packaging :

Cut Tape (CT)

Mounting Type :

Surface Mount

Write Cycle Time - Word, Page :

5ms

Operating Mode :

SYNCHRONOUS

Write Cycle Time-Max (tWC) :

5ms

JESD-30 Code :

R-PDSO-G8

Number of Terminations :

8

Memory Width :

8

Organization :

32KX8

Memory Size :

256Kb 32K x 8

Operating Temperature :

-40°C~85°C TA

Moisture Sensitivity Level (MSL) :

1 (Unlimited)

Terminal Position :

Dual

Memory Interface :

SPI

Additional Feature :

SEATED HT-CALCULATED

Height Seated (Max) :

1.71mm

Supply Voltage-Max (Vsup) :

5.5V

Memory Density :

262144 bit

Supply Voltage-Min (Vsup) :

1.6V

Package / Case :

8-SOIC (0.173, 4.40mm Width)

Parallel/Serial :

Serial

Clock Frequency :

20MHz

Length :

5mm

Width :

4.4mm

Memory Type :

Non-Volatile

Memory Format :

EEPROM