BR25A256F-3MGE2

Manufacturer :

ROHM Semiconductor

Product Category :

Memory

Number of Functions :

1

Width :

4.4mm

Additional Feature :

SEATED HT-CALCULATED

Factory Lead Time :

9 Weeks

Memory Type :

Non-Volatile

Surface Mount :

yes

Voltage - Supply :

2.5V~5.5V

Terminal Position :

Dual

Write Cycle Time - Word, Page :

5ms

JESD-30 Code :

R-PDSO-G8

RoHS Status :

ROHS3 Compliant

Parallel/Serial :

Serial

Supply Voltage-Max (Vsup) :

5.5V

Operating Mode :

SYNCHRONOUS

Memory Interface :

SPI

Length :

5mm

Organization :

32KX8

Write Cycle Time-Max (tWC) :

5ms

Number of Terminations :

8

Series :

Automotive, AEC-Q100

Package / Case :

8-SOIC (0.173, 4.40mm Width)

Height Seated (Max) :

1.71mm

Moisture Sensitivity Level (MSL) :

1 (Unlimited)

Memory Format :

EEPROM

Serial Bus Type :

SPI

Packaging :

Tape and Reel (TR)

Supply Voltage-Min (Vsup) :

2.5V

Clock Frequency :

10MHz

Peak Reflow Temperature (Cel) :

NOT SPECIFIED

Memory Density :

262144 bit

Operating Temperature :

-40°C~105°C TA

Mounting Type :

Surface Mount

Memory Size :

256Kb 32K x 8

Terminal Pitch :

1.27mm

Time@Peak Reflow Temperature-Max (s) :

NOT SPECIFIED

Memory Width :

8