BR24L16FJ-WE2
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- Mfr.Part #
- BR24L16FJ-WE2
- Manufacturer
- ROHM Semiconductor
- Package / Case
- 8-SOIC (0.154, 3.90mm Width)
- Datasheet
- Download
- Description
- IC EEPROM 16KBIT I2C 8SOPJ
- Stock
- 8,376
- In Stock ：
- 8,376
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- Manufacturer :
- ROHM Semiconductor
- Product Category :
- Memory
- Interface :
- 2-Wire, I2C, Serial
- Number of Terminations :
- 8
- Memory Size :
- 16Kb 2K x 8
- Number of Functions :
- 1
- Endurance :
- 1000000 Write/Erase Cycles
- Pbfree Code :
- yes
- JESD-609 Code :
- e2
- Nominal Supply Current :
- 2mA
- ECCN Code :
- EAR99
- Packaging :
- Tape and Reel (TR)
- Supply Voltage :
- 2.5V
- Memory Type :
- Non-Volatile
- Access Time :
- 900 ns
- Terminal Position :
- Dual
- Write Cycle Time - Word, Page :
- 5ms
- Mounting Type :
- Surface Mount
- Number of Pins :
- 8
- Time@Peak Reflow Temperature-Max (s) :
- 10
- Operating Temperature :
- -40°C~85°C TA
- I2C Control Byte :
- 1010MMMR
- Base Part Number :
- BR24L16
- Memory Interface :
- I2C
- Memory Format :
- EEPROM
- Pin Count :
- 8
- Serial Bus Type :
- I2C
- Power Supplies :
- 2/5V
- Published :
- 2005
- Contact Plating :
- Copper, Tin
- Package / Case :
- 8-SOIC (0.154, 3.90mm Width)
- Standby Current-Max :
- 0.000002A
- Length :
- 4.9mm
- Supply Voltage-Max (Vsup) :
- 5.5V
- REACH SVHC :
- No SVHC
- Width :
- 3.9mm
- Voltage - Supply :
- 1.8V~5.5V
- Write Cycle Time-Max (tWC) :
- 5ms
- Write Protection :
- Hardware
- Radiation Hardening :
- No
- Height Seated (Max) :
- 1.775mm
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Supply Voltage-Min (Vsup) :
- 1.7V
- Peak Reflow Temperature (Cel) :
- 260
- Data Retention Time-Min :
- 40
- Clock Frequency :
- 400kHz
- Terminal Pitch :
- 1.27mm
- Termination :
- SMD/SMT
- RoHS Status :
- ROHS3 Compliant
- Density :
- 16 Kb
- Lead Free :
- Lead Free
- Memory Width :
- 8
- Terminal Finish :
- Tin/Copper (Sn/Cu)
- Factory Lead Time :
- 11 Weeks
- Mount :
- Surface Mount
- Datasheets
- BR24L16FJ-WE2
Memory ROHM Semiconductor BR24L16FJ-WE2 Overview
Introducing the BR24L16FJ-WE2, an exceptional EEPROM solution crafted by ROHM Semiconductor. This Integrated Circuit (IC) boasts a generous 16KBIT memory capacity, ensuring ample space for data storage and retrieval. Its I2C interface facilitates seamless communication, while the compact 8SOPJ package enhances integration flexibility.
Engineered with precision and reliability in mind, the BR24L16FJ-WE2 is tailored to meet the demands of modern electronic applications. Its robust design and advanced features make it an ideal choice for various industrial and commercial endeavors.
BR24L16FJ-WE2 Features
- 16KBIT EEPROM: Offers expansive memory capacity for data storage and retrieval.
- I2C Interface: Facilitates easy communication and integration with other devices.
- Compact 8SOPJ Package: Enhances versatility and space efficiency in electronic designs.
- Reliable Performance: Engineered by ROHM Semiconductor for long-term durability and stability.
- Low Power Consumption: Ideal for battery-operated devices, ensuring extended usage without frequent recharging.
- Wide Temperature Range: Suitable for diverse operating environments, from industrial settings to consumer electronics.
BR24L16FJ-WE2 Applications
- Automotive Systems: The BR24L16FJ-WE2 finds application in automotive electronics, such as engine control units (ECUs), dashboard displays, and infotainment systems. Its robust design and wide temperature range ensure reliable performance even in harsh automotive environments.
- Industrial Automation: Leveraging its I2C interface and expansive memory capacity, this EEPROM IC is utilized in industrial automation equipment for data logging, parameter storage, and configuration management. Its compact form factor and low power consumption make it suitable for space-constrained and energy-efficient industrial setups.
- Consumer Electronics: From smart appliances to wearable devices, the BR24L16FJ-WE2 plays a vital role in various consumer electronics applications. Its compact size and low power consumption make it an ideal choice for devices where space and energy efficiency are paramount.
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