BM10JC-60DP-0.4V(53)

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Mfr.Part #
BM10JC-60DP-0.4V(53)
Manufacturer
Hirose
Package / Case
Datasheet
Download
Description
CONN HDR 60POS SMD GOLD
Stock
46,279
In Stock :
46,279

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Manufacturer :
Hirose
Product Category :
Arrays, Edge Type, Mezzanine (Board to Board)
Height Above Board :
0.025 0.63mm
ECCN Code :
EAR99
Connector Type :
Header, Outer Shroud Contacts
Reach Compliance Code :
Unknown
Mounting Type :
Surface Mount
RoHS Status :
RoHS Compliant
Series :
BM10
Feature :
Solder Retention
Contact Finish :
Gold
Mount :
Surface Mount
Packaging :
Tape and Reel (TR)
Stack Height (Mating) :
600μm
Pitch :
0.016 0.40mm
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
HTS Code :
8536.69.40.40
Contact Finish Thickness :
2.00μin 0.051μm
Number of Rows :
2
Factory Lead Time :
10 Weeks
Number of Positions :
60
Introducing Arrays, Edge Type, Mezzanine (Board to Board) Hirose BM10JC-60DP-0.4V(53) from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, BM10JC-60DP-0.4V(53) pinout, BM10JC-60DP-0.4V(53) datasheet PDF, BM10JC-60DP-0.4V(53) amp .Beyond Arrays, Edge Type, Mezzanine (Board to Board) Hirose BM10JC-60DP-0.4V(53) ,we also offer 5054761010, 5035481222, AXT510124, Our vast inventory has you covered. Contact us now for immediate solutions.



Header, Outer Shroud Contacts Tape & Reel (TR) 2 Rows 0.016 0.40mm Surface Mount 60 Positions BM10 Gold

BM10JC-60DP-0.4V(53) Overview


Packaging for this item is Header, Outer Shroud Contacts.It is necessary to use a Tape & Reel (TR) case for packaging the product.There is a mounting type of Surface Mount for this device.This product is part of the BM10 Series.In operation, it is possible to ensure that Solder Retention is maintained.This part requires a Surface Mount socket for mounting.

BM10JC-60DP-0.4V(53) Features


BM10 series
Package / Case: Tape & Reel (TR)
Mounting Type:Surface Mount


BM10JC-60DP-0.4V(53) Applications


There are a lot of Hirose Electric Co Ltd
BM10JC-60DP-0.4V(53) Rectangular Connectors applications.


  • Transportation
  • Embedded systems
  • Datacom
  • Communication
  • Medical technology
  • Military Technology
  • Measuring & Control Technology
  • Instrumentation
  • Automotive Electronics
  • Telecommunications
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