BM10JC-34DS-0.4V(53)

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Mfr.Part #
BM10JC-34DS-0.4V(53)
Manufacturer
Hirose
Package / Case
Datasheet
Download
Description
CONN RCPT 34POS SMD GOLD
Stock
43,733
In Stock :
43,733

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Manufacturer :
Hirose
Product Category :
Arrays, Edge Type, Mezzanine (Board to Board)
Pitch :
0.016 0.40mm
RoHS Status :
RoHS Compliant
Reach Compliance Code :
Unknown
Stack Height (Mating) :
0.8mm
Series :
BM10
Connector Type :
Receptacle, Center Strip Contacts
Number of Positions :
34
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
ECCN Code :
EAR99
Mount :
Surface Mount
Packaging :
Tape and Reel (TR)
HTS Code :
8536.69.40.40
Contact Finish Thickness :
2.00μin 0.051μm
Mounting Type :
Surface Mount
Height Above Board :
0.031 0.80mm
Number of Rows :
2
Factory Lead Time :
10 Weeks
Feature :
Solder Retention
Contact Finish :
Gold
Introducing Arrays, Edge Type, Mezzanine (Board to Board) Hirose BM10JC-34DS-0.4V(53) from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, BM10JC-34DS-0.4V(53) pinout, BM10JC-34DS-0.4V(53) datasheet PDF, BM10JC-34DS-0.4V(53) amp .Beyond Arrays, Edge Type, Mezzanine (Board to Board) Hirose BM10JC-34DS-0.4V(53) ,we also offer 5054761010, 5035481222, AXT510124, Our vast inventory has you covered. Contact us now for immediate solutions.



Receptacle, Center Strip Contacts Tape & Reel (TR) 2 Rows 0.016 0.40mm Surface Mount 34 Positions BM10 Gold

BM10JC-34DS-0.4V(53) Overview


Packaging for this item is Receptacle, Center Strip Contacts.It is necessary to use a Tape & Reel (TR) case for packaging the product.There is a mounting type of Surface Mount for this device.This product is part of the BM10 Series.In operation, it is possible to ensure that Solder Retention is maintained.This part requires a Surface Mount socket for mounting.

BM10JC-34DS-0.4V(53) Features


BM10 series
Package / Case: Tape & Reel (TR)
Mounting Type:Surface Mount


BM10JC-34DS-0.4V(53) Applications


There are a lot of Hirose Electric Co Ltd
BM10JC-34DS-0.4V(53) Rectangular Connectors applications.


  • Transportation
  • Embedded systems
  • Datacom
  • Communication
  • Medical technology
  • Military Technology
  • Measuring & Control Technology
  • Instrumentation
  • Automotive Electronics
  • Telecommunications
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