BD57011AGWL-E2

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Mfr.Part #
BD57011AGWL-E2
Manufacturer
ROHM Semiconductor
Package / Case
42-UFBGA, WLCSP
Datasheet
Download
Description
IC WIRELESS PWR RCVR UCSP50L3C
Stock
50
In Stock :
50

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Manufacturer :
ROHM Semiconductor
Product Category :
Power Management - Specialized
Operating Temperature :
-20°C~85°C
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
RoHS Status :
ROHS3 Compliant
Package / Case :
42-UFBGA, WLCSP
Packaging :
Tape and Reel (TR)
Voltage - Supply :
0V~15V
Factory Lead Time :
15 Weeks
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Applications :
Wireless Power Receiver
ECCN Code :
EAR99
HTS Code :
8542.39.00.01
Mounting Type :
Surface Mount
Analog IC - Other Type :
POWER SUPPLY SUPPORT CIRCUIT
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Current - Supply :
28mA
Datasheets
BD57011AGWL-E2
Introducing Power Management - Specialized ROHM Semiconductor BD57011AGWL-E2 from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-20°C~85°C, Package / Case:42-UFBGA, WLCSP, Mounting Type:Surface Mount, BD57011AGWL-E2 pinout, BD57011AGWL-E2 datasheet PDF, BD57011AGWL-E2 amp .Beyond Power Management - Specialized ROHM Semiconductor BD57011AGWL-E2 ,we also offer LTC3225EDDB-1#TRMPBF, STWLC68JRH, LP3972SQ-I514/NOPB, Our vast inventory has you covered. Contact us now for immediate solutions.

ROHM Semiconductor BD57011AGWL-E2


Power Management - Specialized ROHM Semiconductor BD57011AGWL-E2 Overview

The Power Management - Specialized BD57011AGWL-E2 from ROHM Semiconductor is an advanced integrated circuit designed to revolutionize wireless power reception. Engineered with cutting-edge technology, this IC Wireless Power Receiver in UCSP50L3C package offers unparalleled performance and reliability.

With its compact design and high efficiency, the BD57011AGWL-E2 enables seamless wireless power transfer, making it ideal for a wide range of applications in various industries.

Whether you're designing consumer electronics, automotive systems, or industrial equipment, this innovative solution delivers the power and flexibility you need to stay ahead of the competition.

BD57011AGWL-E2 Features

  • Advanced integrated circuit for wireless power reception
  • Compact UCSP50L3C package
  • High efficiency and reliability
  • Optimized for seamless power transfer
  • Ideal for consumer electronics, automotive systems, and industrial equipment

BD57011AGWL-E2 Applications

  • Wireless Charging Pads: The BD57011AGWL-E2 is perfect for integrating into wireless charging pads for smartphones, tablets, and other portable devices. Its high efficiency ensures fast and reliable charging, enhancing user experience and convenience.
  • Automotive Charging Systems: In automotive applications, this IC is used to develop wireless charging systems for electric vehicles (EVs) and plug-in hybrid electric vehicles (PHEVs). Its compact design and robust performance make it an ideal choice for the demanding automotive environment.
  • Industrial Automation: For industrial equipment requiring wireless power reception, such as sensors, actuators, and monitoring devices, the BD57011AGWL-E2 provides a reliable solution. Its advanced features ensure stable power delivery, improving overall system performance and efficiency.
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