BAS40,215

Manufacturer :

NXP Semiconductors

Product Category :

Unclassified

Number of Elements :

1

Qualification Status :

Not Qualified

Terminal Finish :

Tin (Sn)

RoHS Status :

ROHS3 Compliant

Mounting Type :

Surface Mount

Terminal Form :

Gull wing

Package / Case :

TO-236-3, SC-59, SOT-23-3

Operating Temperature - Junction :

150°C Max

ECCN Code :

EAR99

Capacitance @ Vr, F :

5pF @ 0V 1MHz

Voltage - Forward (Vf) (Max) @ If :

1V @ 40mA

Terminal Position :

Dual

Peak Reflow Temperature (Cel) :

260

Number of Pins :

3

Speed :

Small Signal =< 200mA (Io), Any Speed

Base Part Number :

BAS40

Packaging :

Tape and Reel (TR)

Forward Current :

120mA

Number of Terminations :

3

Operating Temperature (Max) :

150°C

Forward Voltage :

380mV

Current - Reverse Leakage @ Vr :

10μA @ 40V

Voltage - DC Reverse (Vr) (Max) :

40V

Factory Lead Time :

4 Weeks

Diode Element Material :

SILICON

HTS Code :

8541.10.00.70

Reverse Recovery Time-Max :

0.0001μs

Rep Pk Reverse Voltage-Max :

40V

Output Current-Max :

0.12A

Surface Mount :

yes

JESD-609 Code :

e3

Configuration :

Single

Moisture Sensitivity Level (MSL) :

1 (Unlimited)

Current - Average Rectified (Io) :

120mA DC

Pin Count :

3

Diode Type :

Schottky

Time@Peak Reflow Temperature-Max (s) :

40