B4071B7L111260E100

Manufacturer :

Amphenol Communications Solutions

Product Category :

Arrays, Edge Type, Mezzanine (Board to Board)

Peripherals :

Brown-out Detect/Reset, Crypto - AES, DMA, LVD, POR, PWM, SHA, TRNG, WDT

Termination Style :

Solder

Brand :

Amphenol Aorora

Program Memory Type :

Flash

Series :

Traveo™ II T2G

Mated Stacking Heights :

-

RoHS :

Details

Program Memory Size :

1.0625MB (1.0625M x 8)

Height Above Board :

0.278 (7.06mm)

Maximum Operating Temperature :

+ 105 C

Product Type :

Board to Board and Mezzanine Connectors

Product Category :

Board to Board and Mezzanine Connectors

Data Rate :

2.5 Gbps

Termination Method :

Push In

Package / Case :

100-LQFP

Number of Positions :

60 Position

Contact Material :

Phosphor Bronze

Data Converters :

A/D 57x12b SAR

Connectivity :

CANbus, FIFO, I²C, IrDA, LINbus, SPI, UART/USART

Housing Material :

Liquid Crystal Polymer (LCP)

Number of Rows :

2

Base Product Number :

B4071B7L

Maximum Data Rate :

2.5 Gbps

RAM Size :

128K x 8

Oscillator Type :

External, Internal

Mounting Type :

Surface Mount

Mounting Angle :

RIGHT ANGLE

Subcategory :

Board to Board and Mezzanine Connectors

Operating Temperature :

-40°C ~ 125°C (TA)

Current Rating :

500 mA

Packaging :

Cut Tape

Features :

Board Guide, Pick and Place

Manufacturer :

Amphenol

Stack Height :

7.05 mm

Body Orientation :

RIGHT ANGLE

Minimum Operating Temperature :

- 40 C

Core Processor :

ARM® Cortex®-M0+, ARM® Cortex®-M4F

Voltage - Supply (Vcc/Vdd) :

2.7V ~ 5.5V

Voltage Rating :

50 V

Product :

Receptacles

Contact Plating :

Gold Plated Contacts

Connector Type :

Receptacle, Center Strip Contacts

Package :

Tape and Reel (TR)

Product Status :

Active

EEPROM Size :

96K x 8

Number of Contacts :

60

Pitch :

0.8mm

Number of I/O :

78

Contact Finish Thickness :

2.00µin (0.051µm)

Core Size :

32-Bit Dual-Core

Supplier Device Package :

100-LQFP (14x14)

Speed :

100MHz, 160MHz

Contact Finish :

Gold