AX250-FG256M
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- Mfr.Part #
- AX250-FG256M
- Manufacturer
- Microchip Technology
- Package / Case
- 256-LBGA
- Datasheet
- Download
- Description
- IC FPGA 138 I/O 256FBGA
- Stock
- 24,409
- In Stock ：
- 24,409
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- Manufacturer :
- Microchip Technology
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Number of Logic Elements/Cells :
- 2816
- Number of Pins :
- 256
- Operating Supply Voltage :
- 1.5V
- Height :
- 1.2mm
- Terminal Pitch :
- 1mm
- Number of Outputs :
- 248
- Radiation Hardening :
- No
- Peak Reflow Temperature (Cel) :
- 225
- HTS Code :
- 8542.39.00.01
- Supply Voltage :
- 1.5V
- RoHS Status :
- Non-RoHS Compliant
- Number of Terminations :
- 256
- Power Supplies :
- 1.51.5/3.32.5/3.3V
- Terminal Position :
- BOTTOM
- Width :
- 17mm
- Length :
- 17mm
- Max Frequency :
- 649MHz
- RAM Size :
- 6.8kB
- Propagation Delay :
- 990 ps
- Number of Gates :
- 250000
- Combinatorial Delay of a CLB-Max :
- 0.99 ns
- Operating Temperature :
- -55°C~125°C TA
- Screening Level :
- MIL-STD-883 Class B
- Number of LABs/CLBs :
- 4224
- Voltage - Supply :
- 1.425V~1.575V
- Mounting Type :
- Surface Mount
- Terminal Form :
- Ball
- Total RAM Bits :
- 55296
- Packaging :
- Tray
- Number of I/O :
- 138
- ECCN Code :
- 3A001.A.2.C
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Lifecycle Status :
- IN PRODUCTION (Last Updated: 4 weeks ago)
- Published :
- 2005
- Series :
- Axcelerator
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Factory Lead Time :
- 22 Weeks
- Terminal Finish :
- TIN LEAD/TIN LEAD SILVER
- Base Part Number :
- AX250
- Mount :
- Surface Mount
- Weight :
- 400.011771mg
- Package / Case :
- 256-LBGA
- Datasheets
- AX250-FG256M
FPGAs Microchip Technology AX250-FG256M Overview
The FPGAs Microchip Technology AX250-FG256M is an advanced field programmable gate array (FPGA) designed to meet the increasing demands of complex digital systems. This device, manufactured by Microchip Technology, offers a robust platform for developers with its high I/O count and compact 256FBGA packaging. It's engineered to deliver exceptional performance for applications requiring high-speed data processing and flexibility. With its ability to be reprogrammed on the fly, the AX250-FG256M offers adaptability and longevity in rapidly evolving technological landscapes, making it an ideal choice for industries looking to future-proof their designs.
AX250-FG256M Features
The AX250-FG256M FPGA boasts several key features that make it a competitive option for a wide range of applications. It includes 138 I/O pins which provide ample connectivity for interfacing with other components in complex designs. The 256FBGA package ensures a minimal footprint on the PCB while allowing for dense, integrated designs. This model is tailored for designers who need a balance of power, flexibility, and space efficiency in their electronic projects.
AX250-FG256M Applications
- Consumer Electronics: Used in devices such as smartphones and tablets, the AX250-FG256M can manage multiple functions within a single chip, reducing the overall hardware costs and power consumption.
- Automotive Applications: This FPGA is ideal for automotive electronics where multiple sensor inputs and real-time processing are crucial, enhancing vehicle safety and performance.
- Industrial Automation: In automation systems, the AX250-FG256M helps in handling complex algorithms required for control processes, improving efficiency and reliability.
- Data Processing: Suited for data centers needing high-speed data processing and storage solutions, it provides the necessary speed and connectivity for managing large data volumes efficiently.
- Telecommunications: This FPGA supports the demands of telecommunications infrastructure by facilitating faster data transmission and higher bandwidth capabilities.
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The basic freight (for package ≤0.5 KG ) depends on the time zones and countries
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