AX125-FG324I

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Mfr.Part #
AX125-FG324I
Manufacturer
Microsemi
Package / Case
324-BGA
Datasheet
Download
Description
IC FPGA 168 I/O 324FBGA
Stock
49,982
In Stock :
49,982

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Manufacturer :
Microsemi
Product Category :
FPGAs (Field Programmable Gate Array)
Mounting Type :
Surface Mount
Series :
Axcelerator
Package / Case :
324-BGA
Number of LABs/CLBs :
2016
Terminal Position :
BOTTOM
Number of Outputs :
168
Number of Gates :
125000
Time@Peak Reflow Temperature-Max (s) :
30
Terminal Form :
Ball
Operating Supply Voltage :
1.5V
HTS Code :
8542.39.00.01
Height :
1.25mm
Operating Temperature :
-40°C~85°C TA
Weight :
400.011771mg
Total RAM Bits :
18432
Number of Terminations :
324
Width :
19mm
Number of Pins :
324
Length :
19mm
RoHS Status :
Non-RoHS Compliant
Propagation Delay :
990 ps
Number of I/O :
168
Terminal Pitch :
1mm
Mount :
Surface Mount
JESD-609 Code :
e0
Power Supplies :
1.51.5/3.32.5/3.3V
Combinatorial Delay of a CLB-Max :
0.99 ns
Voltage - Supply :
1.425V~1.575V
RAM Size :
2.3kB
Turn On Delay Time :
990 ps
Published :
2012
Packaging :
Tray
Frequency :
649MHz
Lifecycle Status :
OBSOLETE (Last Updated: 3 weeks ago)
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Number of Registers :
1344
Base Part Number :
AX125
Supply Voltage :
1.5V
Radiation Hardening :
No
Peak Reflow Temperature (Cel) :
225
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Terminal Finish :
Tin/Lead/Silver (Sn/Pb/Ag)
Datasheets
AX125-FG324I
Introducing FPGAs (Field Programmable Gate Array) Microsemi AX125-FG324I from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Package / Case:324-BGA, Operating Temperature:-40°C~85°C TA, Number of Terminations:324, Number of Pins:324, Base Part Number:AX125, AX125-FG324I pinout, AX125-FG324I datasheet PDF, AX125-FG324I amp .Beyond FPGAs (Field Programmable Gate Array) Microsemi AX125-FG324I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.



1.5V V 990 ps ns FPGAs Axcelerator Series 649MHz MHz 324-BGA 1mm mm 324

AX125-FG324I Overview


A 324-BGA package contains it, and it is available for download. There are FIELD PROGRAMMABLE GATE ARRAY transistors in this type of FPGA. Its 168 I/Os help it transfer data more efficiently. Power is provided by a 1.5V-volt supply. The Surface Mount-slot connector on the FPGA module can be connected to the development board. Fpga chips operates at a voltage of 1.425V~1.575V and uses a battery to supply power. FPGAs belonging to the Axcelerator series are a type of FPGA that belong to the Axcelerator series of FPGAs. Operating temperatures should be maintained within the -40°C~85°C TA range at all times when the unit is in use. During the installation of this device, 168 outputs were incorporated. A model of this FPGA is contained in Tray for the purpose of saving space. In total, there are a total of 324 terminations on fpga chips. Having a RAM bit size of 18432 means that this device will offer you a lot of memory. For related parts, use its base part number AX125. A significant amount of RAM is allocated to this FPGA module to ensure that the program can operate normally. This cable has 324 pins and is designed to connect to a computer. 2016 LABs/CLBs are integrated into this FPGA. Providing the FPGA is mounted in Surface Mount as per the specifications of the IC, then it should work perfectly according to its specifications. With a 1.5V supply voltage, designers can fully utilize the flexibility of the device. Power is supplied to the device by a 1.51.5/3.32.5/3.3V battery. 125000 gates make up the basic block of its construction. The registers used in the transfer of and storage of data are 1344 in number. A frequency of 649MHz provides high efficiency.

AX125-FG324I Features


168 I/Os
Up to 18432 RAM bits
324 LABs/CLBs
1344 registers
Operating from a frequency of 649MHz


AX125-FG324I Applications


There are a lot of Microsemi Corporation
AX125-FG324I FPGAs applications.


  • Integrating multiple SPLDs
  • Voice recognition
  • Cryptography
  • Filtering and communication encoding
  • Aerospace and Defense
  • Medical Electronics
  • Audio
  • Automotive
  • Consumer Electronics
  • Distributed Monetary Systems
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