ASP-134487-01

Manufacturer :

Samtec, Inc.

Product Category :

Arrays, Edge Type, Mezzanine (Board to Board)

Option :

GENERAL PURPOSE

JESD-609 Code :

e3

Body Depth :

0.28 inch

Height :

7.24mm

Insulation Material :

Liquid Crystal Polymer (LCP)

Mating Contact Row Spacing :

0.05 inch

Pitch :

0.050 1.27mm

Mount :

Surface Mount

DIN Conformance :

No

Contact Material :

Gold, Nickel

PCB Contact Pattern :

RECTANGULAR

Body Breadth :

0.578 inch

Body Length or Diameter :

2.196 inch

Reference Standard :

UL

IEC Conformance :

No

Factory Lead Time :

3 Weeks

Contact Finish :

Gold

Contact Pattern :

RECTANGULAR

Feature :

Board Guide

Number of Positions :

400

Filter Feature :

No

Termination :

Solder

ECCN Code :

EAR99

Mounting Type :

Surface Mount

PCB Contact Row Spacing :

1.27 mm

Insulator Color :

Black

Moisture Sensitivity Level (MSL) :

1 (Unlimited)

HTS Code :

8536.69.40.40

Published :

2012

Contact Style :

SQ PIN-SKT

Number of Rows :

10

RoHS Status :

Non-RoHS Compliant

REACH SVHC :

No SVHC

Number of Conductors :

ONE

Packaging :

Strip

Radiation Hardening :

No

Body/Shell Style :

Receptacle

Total Number of Contacts :

400

Series :

ASP

Reliability :

COMMERCIAL

MIL Conformance :

No

Gender :

Male

Number Of PCB Rows :

10

Height Above Board :

0.245 6.22mm

Mixed Contacts :

No

Plating Thickness :

30μin

Connector Type :

High Density Array, Male

Contact Finish Thickness :

30.0μin 0.76μm