AS6C2008A-55BIN

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Mfr.Part #
AS6C2008A-55BIN
Manufacturer
Alliance Memory, Inc.
Package / Case
36-TFBGA
Datasheet
Download
Description
IC SRAM 2MBIT PARALLEL 36TFBGA
Stock
21,645
In Stock :
21,645

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Manufacturer :
Alliance Memory, Inc.
Product Category :
Memory
Packaging :
Tray
Memory Format :
SRAM
Memory Size :
2Mb 256K x 8
Reach Compliance Code :
Unknown
Mounting Type :
Surface Mount
Pbfree Code :
yes
RoHS Status :
ROHS3 Compliant
Memory Type :
Volatile
Voltage - Supply :
2.7V~5.5V
Memory Interface :
Parallel
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Write Cycle Time - Word, Page :
55ns
Operating Temperature :
-40°C~85°C TA
Published :
2007
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Package / Case :
36-TFBGA
Factory Lead Time :
8 Weeks
Datasheets
AS6C2008A-55BIN
Introducing Memory Alliance Memory, Inc. AS6C2008A-55BIN from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Operating Temperature:-40°C~85°C TA, Package / Case:36-TFBGA, AS6C2008A-55BIN pinout, AS6C2008A-55BIN datasheet PDF, AS6C2008A-55BIN amp .Beyond Memory Alliance Memory, Inc. AS6C2008A-55BIN ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Alliance Memory, Inc. AS6C2008A-55BIN


Memory Alliance Memory, Inc. AS6C2008A-55BIN Overview

Introducing the Memory Alliance Memory, Inc. AS6C2008A-55BIN, a cutting-edge 2Mbit SRAM component engineered for high-speed and reliable performance in a compact 36TFBGA package. This integrated circuit from Alliance Memory, Inc. offers a balanced blend of speed, power efficiency, and robust data retention capabilities. Designed to meet the rigorous demands of advanced embedded systems, this SRAM module ensures optimal performance with its 55ns access time, making it an excellent choice for applications requiring fast and continuous data access without compromising power consumption.

AS6C2008A-55BIN Features

The AS6C2008A-55BIN stands out with its high-density 2Mbit storage capacity and 55ns access time. The device operates over a wide temperature range, ensuring reliability and stability under varying environmental conditions. Its 36TFBGA packaging not only reduces the footprint on the PCB but also enhances the thermal management and durability of the module. Furthermore, its parallel interface facilitates easier integration into existing designs, making it a versatile choice for designers looking to upgrade their system's memory capabilities without major redesigns.

AS6C2008A-55BIN Applications

  • Industrial Control Systems: Employs the AS6C2008A-55BIN for handling complex algorithms and real-time data logging, enhancing process control and operational efficiency.
  • Automotive Electronics: Utilizes the SRAM in driver assistance systems to quickly process sensor data, ensuring rapid response times and increased safety on the road.
  • Internet of Things (IoT) Devices: Provides the memory backbone for IoT devices requiring efficient power usage and capable of operating under varying environmental conditions, thus extending device longevity.
  • Telecommunications: Supports telecommunications equipment with enhanced data buffer capabilities, improving data flow and system reliability in communication networks.
  • Consumer Electronics: Applied in devices like digital cameras and gaming consoles, where quick data access is crucial for high-performance and enhanced user experience.
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IMPORTANT NOTICE

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Shipping Method

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Shipping Cost

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