AS6C2008-55BIN

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Mfr.Part #
AS6C2008-55BIN
Manufacturer
Alliance Memory, Inc.
Package / Case
36-TFBGA
Datasheet
Download
Description
IC SRAM 2MBIT PARALLEL 36TFBGA
Stock
46,247
In Stock :
46,247

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Manufacturer :
Alliance Memory, Inc.
Product Category :
Memory
Mounting Type :
Surface Mount
Terminal Pitch :
0.75mm
I/O Type :
COMMON
Memory Size :
2Mb 256K x 8
Address Bus Width :
18b
Operating Supply Voltage :
3V
Factory Lead Time :
8 Weeks
Package / Case :
36-TFBGA
RoHS Status :
ROHS3 Compliant
Write Cycle Time - Word, Page :
55ns
Density :
2 Mb
Time@Peak Reflow Temperature-Max (s) :
40
Output Characteristics :
3-STATE
Published :
2006
Peak Reflow Temperature (Cel) :
260
Memory Type :
Volatile
Terminal Position :
BOTTOM
Surface Mount :
yes
Supply Voltage-Max (Vsup) :
3.6V
Voltage - Supply :
2.7V~3.6V
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Packaging :
Tray
Organization :
256KX8
Supply Current-Max :
0.035mA
Length :
8mm
Radiation Hardening :
No
Access Time (Max) :
55 ns
Pin Count :
36
Number of Pins :
36
Memory Width :
8
Supply Voltage-Min (Vsup) :
2.7V
Number of Terminations :
36
Number of Functions :
1
Memory Interface :
Parallel
Pbfree Code :
yes
Memory Format :
SRAM
Operating Temperature :
-40°C~85°C TA
Number of Ports :
1
Supply Voltage :
3V
Datasheets
AS6C2008-55BIN
Introducing Memory Alliance Memory, Inc. AS6C2008-55BIN from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Package / Case:36-TFBGA, Number of Pins:36, Number of Terminations:36, Operating Temperature:-40°C~85°C TA, AS6C2008-55BIN pinout, AS6C2008-55BIN datasheet PDF, AS6C2008-55BIN amp .Beyond Memory Alliance Memory, Inc. AS6C2008-55BIN ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Alliance Memory, Inc. AS6C2008-55BIN


Memory Alliance Memory, Inc. AS6C2008-55BIN Overview

The Memory Alliance Memory, Inc. AS6C2008-55BIN is a high-performance 2Mbit SRAM chip designed for demanding applications that require rapid access to memory storage. Its 36TFBGA packaging makes it both compact and efficient, suitable for tightly packed system designs. This IC SRAM utilizes a parallel interface, ensuring high-speed data access and communication, which is crucial for applications requiring quick read and write operations. The robust design and reliable output make it an ideal choice for manufacturers looking to integrate dependable memory solutions into their advanced electronic systems.

AS6C2008-55BIN Features

  • 2Mbit storage capacity
  • Parallel interface for high-speed data transfer
  • 36TFBGA packaging for reduced space usage and enhanced reliability
  • Optimized for low power consumption
  • Wide operating temperature range suitable for various environments

AS6C2008-55BIN Applications

  • Automotive electronics: Utilized in automotive control systems to handle fast data logging and real-time system monitoring.
  • Industrial automation: Serves as a core component in PLC systems where fast access to data is crucial for efficient process control.
  • Telecommunications: Supports communication equipment requiring fast and reliable data buffering and storage.
  • Consumer electronics: Integrated into devices like digital cameras and gaming consoles to provide quick read/write operations for enhanced performance.
  • Medical devices: Used in medical diagnostic equipment for quick data processing, ensuring rapid response times necessary in medical applications.
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Shipping Method

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Shipping Cost

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