AS4C16M16S-6TCNTR

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Mfr.Part #
AS4C16M16S-6TCNTR
Manufacturer
Alliance Memory, Inc.
Package / Case
54-TSOP (0.400, 10.16mm Width)
Datasheet
Download
Description
IC DRAM 256MBIT PAR 54TSOP II
Stock
31,489
In Stock :
31,489

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Manufacturer :
Alliance Memory, Inc.
Product Category :
Memory
Memory Interface :
Parallel
Factory Lead Time :
8 Weeks
Density :
256 Mb
Number of Terminations :
54
Pin Count :
54
Data Bus Width :
16b
Terminal Pitch :
0.8mm
Package / Case :
54-TSOP (0.400, 10.16mm Width)
Additional Feature :
AUTO/SELF REFRESH
Peak Reflow Temperature (Cel) :
260
Access Time :
5.4ns
Organization :
16MX16
Number of Ports :
1
Supply Voltage-Min (Vsup) :
3V
RoHS Status :
RoHS Compliant
Surface Mount :
yes
Memory Size :
256Mb 16M x 16
Address Bus Width :
13b
Pbfree Code :
yes
Length :
22.22mm
Operating Temperature :
0°C~70°C TA
Packaging :
Tape and Reel (TR)
Terminal Finish :
PURE MATTE TIN/TIN BISMUTH
Number of Pins :
54
Number of Functions :
1
Radiation Hardening :
No
Memory Width :
16
Write Cycle Time - Word, Page :
12ns
Voltage - Supply :
3V~3.6V
ECCN Code :
EAR99
Memory Format :
DRAM
Published :
2014
Height Seated (Max) :
1.2mm
Time@Peak Reflow Temperature-Max (s) :
40
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Supply Voltage :
3.3V
Mounting Type :
Surface Mount
Supply Voltage-Max (Vsup) :
3.6V
Terminal Position :
Dual
Memory Type :
Volatile
Operating Supply Voltage :
3.3V
Clock Frequency :
166MHz
JESD-609 Code :
e3/e6
Datasheets
AS4C16M16S-6TCNTR
Introducing Memory Alliance Memory, Inc. AS4C16M16S-6TCNTR from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:54, Package / Case:54-TSOP (0.400, 10.16mm Width), Operating Temperature:0°C~70°C TA, Number of Pins:54, Mounting Type:Surface Mount, AS4C16M16S-6TCNTR pinout, AS4C16M16S-6TCNTR datasheet PDF, AS4C16M16S-6TCNTR amp .Beyond Memory Alliance Memory, Inc. AS4C16M16S-6TCNTR ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Alliance Memory, Inc. AS4C16M16S-6TCNTR


Memory Alliance Memory, Inc. AS4C16M16S-6TCNTR Overview

The Memory Alliance Memory, Inc. AS4C16M16S-6TCNTR DRAM is a high-performance, 256 Mbit memory module designed to meet the demands of a wide range of computing and digital devices. Crafted in a compact 54TSOP II package, this IC (Integrated Circuit) provides robust data storage and retrieval capabilities, making it an ideal choice for applications requiring high-speed memory operations and stable performance. Its efficient design ensures reduced power consumption, while maintaining reliability and durability for intensive operational requirements, thereby appealing to B2B customers seeking volume procurement for high-tech solutions.

AS4C16M16S-6TCNTR Features

This DRAM module boasts several features that enhance its appeal in professional and industrial markets. Key features include a parallel interface for straightforward integration with existing technology, a standard 54TSOP II form factor for compatibility with a wide range of hardware, and a substantial data storage capacity of 256 Mbit. Moreover, the AS4C16M16S-6TCNTR is designed for low power consumption, which is crucial for energy-sensitive applications, enhancing its operational efficiency and environmental sustainability.

AS4C16M16S-6TCNTR Applications

  • Consumer Electronics: Utilized in televisions, gaming consoles, and home theater systems where large volume data buffering is essential for high-definition video and audio processing.
  • Communications Equipment: Employed in routers, switches, and networking hubs to manage data throughput and buffer operations effectively, ensuring reliable and uninterrupted service.
  • Automotive Systems: Integral in advanced driver-assistance systems (ADAS) and infotainment systems for buffering and processing large volumes of sensor and multimedia data.
  • Industrial Automation: Applied in PLCs and industrial PCs where robust memory is crucial for real-time processing and control tasks in complex manufacturing processes.
  • Medical Equipment: Used in medical imaging devices such as MRI and ultrasound machines, where rapid data access and high-volume storage capacity are critical for detailed imaging and diagnostics.
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