APA750-FG676
- Mfr.Part #
- APA750-FG676
- Manufacturer
- Microsemi
- Package / Case
- 676-BGA
- Datasheet
- Download
- Description
- IC FPGA 454 I/O 676FBGA
- Stock
- 23,442
- In Stock :
- 23,442
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- Manufacturer :
- Microsemi
- Product Category :
- FPGAs (Field Programmable Gate Array)
- JESD-609 Code :
- e0
- Series :
- ProASICPLUS
- Peak Reflow Temperature (Cel) :
- 225
- Packaging :
- Tray
- Total RAM Bits :
- 147456
- Base Part Number :
- APA750
- Height :
- 1.73mm
- Published :
- 2009
- Operating Supply Voltage :
- 2.5V
- Width :
- 27mm
- Frequency :
- 180MHz
- Time@Peak Reflow Temperature-Max (s) :
- 30
- RoHS Status :
- Non-RoHS Compliant
- Package / Case :
- 676-BGA
- Lifecycle Status :
- OBSOLETE (Last Updated: 3 weeks ago)
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- HTS Code :
- 8542.39.00.01
- Mounting Type :
- Surface Mount
- Number of Gates :
- 750000
- Terminal Position :
- BOTTOM
- Radiation Hardening :
- No
- Weight :
- 400.011771mg
- Voltage - Supply :
- 2.3V~2.7V
- Length :
- 27mm
- Supply Voltage :
- 2.5V
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- RAM Size :
- 18kb
- Operating Temperature :
- 0°C~70°C TA
- Number of Registers :
- 32768
- Number of Terminations :
- 676
- Power Supplies :
- 2.52.5/3.3V
- Factory Lead Time :
- 16 Weeks
- Number of Outputs :
- 454
- Mount :
- Surface Mount
- Number of Pins :
- 676
- Terminal Form :
- Ball
- Terminal Finish :
- Tin/Lead (Sn/Pb)
- Terminal Pitch :
- 1mm
- Number of I/O :
- 454
- Datasheets
- APA750-FG676

FPGAs Microsemi APA750-FG676 Overview
Introducing the APA750-FG676 from Microsemi, a high-performance FPGA (Field Programmable Gate Array) that combines versatility with high-speed functionality. This FPGA is designed to cater to the demands of complex digital processing applications and is packaged in a 676FBGA format that allows for robust integration in various device architectures. The APA750-FG676 is an excellent choice for designers looking for a mix of high I/O capability, memory integrity, and computational power. With its extensive I/O options and substantial logic density, this FPGAs Microsemi APA750-FG676 is engineered to push the boundaries of technological innovation while optimizing system performance.
APA750-FG676 Features
The APA750-FG676 FPGA boasts an impressive array of features that make it a go-to solution for high-demand applications. It provides 454 I/O pins, allowing extensive connectivity and interfacing options. Housed in a compact 676-pin FBGA package, it ensures efficient space utilization and high-speed signal processing. This chip is built for adaptability and scalability, facilitating a wide range of digital processing tasks with ease and efficiency.
APA750-FG676 Applications
- Telecommunications: Utilized in network infrastructure to manage data flow and signal processing, enhancing communication speed and reliability.
- Aerospace and Defense: Employed in avionics for control systems and navigation, providing robust computing power and reliability under extreme conditions.
- Automotive: Integral in advanced driver-assistance systems (ADAS) for processing real-time data from sensors and cameras, improving vehicle safety and performance.
- Industrial Automation: Used in machine control units for real-time control and monitoring, ensuring high precision and efficiency in manufacturing processes.
- Consumer Electronics: Embedded in devices such as high-definition televisions and gaming consoles, enhancing user experience through superior graphic and processing capabilities.
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