APA300-BGG456I

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Mfr.Part #
APA300-BGG456I
Manufacturer
Microchip Technology
Package / Case
456-BBGA
Datasheet
Download
Description
IC FPGA 290 I/O 456BGA
Stock
11,435
In Stock :
11,435

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Manufacturer :
Microchip Technology
Product Category :
FPGAs (Field Programmable Gate Array)
HTS Code :
8542.39.00.01
Number of I/O :
290
RoHS Status :
RoHS Compliant
Packaging :
Tray
Lifecycle Status :
IN PRODUCTION (Last Updated: 1 month ago)
Supply Voltage :
2.5V
RAM Size :
9kB
Number of Outputs :
290
Terminal Pitch :
1.27mm
Terminal Position :
BOTTOM
Package / Case :
456-BBGA
Radiation Hardening :
No
Series :
ProASICPLUS
Factory Lead Time :
10 Weeks
Width :
35mm
Number of Gates :
300000
Peak Reflow Temperature (Cel) :
245
Height :
1.73mm
Published :
2007
Voltage - Supply :
2.3V~2.7V
Number of Registers :
8192
Operating Supply Voltage :
2.5V
Terminal Finish :
Tin/Silver/Copper (Sn/Ag/Cu)
Number of Terminations :
456
Number of Pins :
456
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Base Part Number :
APA300
Length :
35mm
Max Frequency :
180MHz
Total RAM Bits :
73728
Mount :
Surface Mount
Time@Peak Reflow Temperature-Max (s) :
40
Operating Temperature :
-40°C~85°C TA
Mounting Type :
Surface Mount
Power Supplies :
2.52.5/3.3V
Terminal Form :
Ball
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
JESD-609 Code :
e1
Datasheets
APA300-BGG456I
Introducing FPGAs (Field Programmable Gate Array) Microchip Technology APA300-BGG456I from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:456-BBGA, Number of Terminations:456, Number of Pins:456, Base Part Number:APA300, Operating Temperature:-40°C~85°C TA, Mounting Type:Surface Mount, APA300-BGG456I pinout, APA300-BGG456I datasheet PDF, APA300-BGG456I amp .Beyond FPGAs (Field Programmable Gate Array) Microchip Technology APA300-BGG456I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Microchip Technology APA300-BGG456I


FPGAs Microchip Technology APA300-BGG456I Overview

The APA300-BGG456I from Microchip Technology represents a robust and flexible solution in the realm of Field Programmable Gate Arrays (FPGAs). This device integrates advanced features into a compact 456-ball grid array (BGA) package, enabling engineers and designers to achieve high levels of performance and integration for a variety of complex applications. The FPGA features 290 user I/Os, providing ample connectivity for peripheral and high-speed interfaces. This versatility makes the APA300-BGG456I a prime choice for developers looking for scalable and efficient solutions in sophisticated electronic systems.

APA300-BGG456I Features

The APA300-BGG456I FPGA is designed for optimal functionality and performance. Key features include its 456BGA packaging that allows for a dense and compact board design, 290 I/Os that accommodate a wide range of connections for various applications, and the inherent flexibility of an FPGA for custom configurations. This model's robust architecture supports complex digital computations, making it highly suitable for both prototyping and full-scale production.

APA300-BGG456I Applications

  • Telecommunications Equipment: Utilized in routers and switches, the APA300-BGG456I manages data flow and signal processing tasks efficiently, ensuring reliable and fast communications.
  • Automotive Electronics: In vehicle control systems, this FPGA can handle multiple inputs and outputs necessary for sensor data integration and real-time decision-making in advanced driver-assistance systems (ADAS).
  • Consumer Electronics: Applied in devices like high-definition televisions and gaming consoles, the APA300-BGG456I supports the processing power required for video rendering and complex user interfaces.
  • Industrial Automation: This FPGA is capable of controlling machinery and processes with precision and adaptability, optimizing productivity and reliability in automated production lines.
This content is crafted to highlight the features of the APA300-BGG456I FPGA, focusing on its flexibility, functionality, and potential applications, encouraging bulk purchases from B2B customers in related industries.
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