APA150-BG456
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- Mfr.Part #
- APA150-BG456
- Manufacturer
- Microsemi
- Package / Case
- 456-BBGA
- Datasheet
- Download
- Description
- IC FPGA 242 I/O 456BGA
- Stock
- 39,170
- In Stock ：
- 39,170
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- Manufacturer :
- Microsemi
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Terminal Pitch :
- 1.27mm
- Total RAM Bits :
- 36864
- Number of Pins :
- 456
- Voltage - Supply :
- 2.3V~2.7V
- Width :
- 35mm
- Number of Terminations :
- 456
- Packaging :
- Tray
- Mounting Type :
- Surface Mount
- Mount :
- Surface Mount
- Radiation Hardening :
- No
- RoHS Status :
- Non-RoHS Compliant
- Published :
- 2009
- Peak Reflow Temperature (Cel) :
- 225
- Package / Case :
- 456-BBGA
- Power Supplies :
- 2.52.5/3.3V
- Height :
- 1.73mm
- Terminal Finish :
- TIN LEAD/TIN LEAD SILVER
- Number of I/O :
- 242
- RAM Size :
- 4.5kB
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Max Frequency :
- 180MHz
- Operating Temperature :
- 0°C~70°C TA
- Number of Gates :
- 150000
- Length :
- 35mm
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Number of Registers :
- 6144
- Supply Voltage :
- 2.5V
- Base Part Number :
- APA150
- HTS Code :
- 8542.39.00.01
- Terminal Form :
- Ball
- Lifecycle Status :
- Obsolete (Last Updated: 1 month ago)
- Terminal Position :
- BOTTOM
- Factory Lead Time :
- 8 Weeks
- Series :
- ProASICPLUS
- Operating Supply Voltage :
- 2.5V
- Number of Outputs :
- 242
- Datasheets
- APA150-BG456
FPGAs Microsemi APA150-BG456 Overview
The APA150-BG456 by Microsemi stands out in the world of Field Programmable Gate Arrays (FPGAs) with its robust architecture and versatile capabilities, tailored for sophisticated digital circuits. Designed to meet the demanding needs of modern electronics, this FPGA facilitates rapid prototyping and mass production across various industries. Its substantial I/O capacity and dense 456 BGA packaging make it an ideal choice for developers looking to leverage advanced system-on-chip (SoC) functionalities within compact hardware designs. This integration supports a broad range of applications, from consumer electronics to complex industrial systems, embodying the core attributes of efficiency and scalability that FPGAs Microsemi APA150-BG456 is known for.
APA150-BG456 Features
The APA150-BG456 FPGA offers a diverse range of features that enhance its performance and usability. Key features include a high-density 456-ball grid array (BGA) package that optimizes board space and ensures reliable electrical connections. With 242 programmable I/O pins, it provides ample flexibility for various design configurations. This FPGA also supports multiple logic configurations, allowing for extensive customization to meet specific application requirements. Moreover, its low power consumption and high-speed signal processing capabilities make it a top choice for power-sensitive and high-performance tasks.
APA150-BG456 Applications
- Consumer Electronics: Utilized in devices such as smartphones, tablets, and wearables, the APA150-BG456 helps in managing multiple functionalities while maintaining power efficiency, enhancing device performance and user experience.
- Automotive Systems: Critical in driver assistance systems and infotainment, this FPGA processes complex inputs quickly to deliver real-time responses, essential for safety and functionality in modern vehicles.
- Industrial Automation: In robotics and control systems, the APA150-BG456 streamlines processes by handling various sensor inputs and control outputs simultaneously, improving efficiency and reliability in harsh environments.
- Telecommunications: Essential for network equipment, the FPGA enables high-speed data processing and supports the robust demands of communication infrastructures, ensuring faster and more reliable data transmission.
- Medical Devices: Used in medical imaging and diagnostic equipment, it provides the necessary computational power to handle complex algorithms and large data volumes, ensuring precise and timely health diagnostics.
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