AGLE600V2-FGG484I

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Mfr.Part #
AGLE600V2-FGG484I
Manufacturer
Microsemi
Package / Case
484-BGA
Datasheet
Download
Description
IC FPGA 270 I/O 484FBGA
Stock
23,289
In Stock :
23,289

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Manufacturer :
Microsemi
Product Category :
FPGAs (Field Programmable Gate Array)
Radiation Hardening :
No
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Total RAM Bits :
110592
Mount :
Surface Mount
Voltage - Supply :
1.14V~1.575V
Time@Peak Reflow Temperature-Max (s) :
40
Series :
IGLOOe
Lead Free :
Lead Free
RAM Size :
13.5kB
Height :
1.73mm
Operating Temperature :
-40°C~85°C TA
RoHS Status :
RoHS Compliant
Published :
2012
Terminal Form :
Ball
Max Frequency :
892.86MHz
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
HTS Code :
8542.39.00.01
Number of Gates :
600000
Operating Supply Voltage :
1.5V
Number of Pins :
484
Width :
23mm
Terminal Finish :
TIN SILVER COPPER
Terminal Position :
BOTTOM
Base Part Number :
AGLE600
Packaging :
Tray
Weight :
400.011771mg
Number of Terminations :
484
Number of Outputs :
270
Number of Logic Elements/Cells :
13824
Length :
23mm
Lifecycle Status :
Obsolete (Last Updated: 1 month ago)
Number of I/O :
270
Mounting Type :
Surface Mount
Peak Reflow Temperature (Cel) :
250
Supply Voltage :
1.2V
JESD-609 Code :
e1
Terminal Pitch :
1mm
Package / Case :
484-BGA
Datasheets
AGLE600V2-FGG484I
Introducing FPGAs (Field Programmable Gate Array) Microsemi AGLE600V2-FGG484I from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C~85°C TA, Number of Pins:484, Base Part Number:AGLE600, Number of Terminations:484, Mounting Type:Surface Mount, Package / Case:484-BGA, AGLE600V2-FGG484I pinout, AGLE600V2-FGG484I datasheet PDF, AGLE600V2-FGG484I amp .Beyond FPGAs (Field Programmable Gate Array) Microsemi AGLE600V2-FGG484I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Microsemi AGLE600V2-FGG484I


FPGAs Microsemi AGLE600V2-FGG484I Overview

The FPGAs Microsemi AGLE600V2-FGG484I is a highly capable field programmable gate array designed to meet the advanced requirements of modern digital circuits. Manufactured by Microsemi, this IC features a robust 484FBGA package that allows for efficient thermal management and high-density I/O integration. The versatility of the AGLE600V2-FGG484I makes it an ideal choice for designers looking to deploy complex logic circuits and system-level integration on a single chip. As a key component in advanced electronic systems, this FPGA enables rapid prototyping and scalability, essential for accelerating product development in a competitive market.

AGLE600V2-FGG484I Features

This FPGA is equipped with 270 programmable I/O pins, providing ample connectivity for various peripheral devices and other components essential for a wide range of applications. The 484-ball fine-pitch ball grid array (FBGA) package ensures a compact footprint while maintaining excellent electrical and thermal performance. The high integration capability of the AGLE600V2-FGG484I facilitates complex digital system implementations with reduced power consumption and higher reliability.

AGLE600V2-FGG484I Applications

  • Telecommunications: The AGLE600V2-FGG484I can be integrated into telecommunication infrastructure to manage signal processing tasks, contributing to the efficiency and reliability of network operations.
  • Automotive Electronics: This FPGA is suitable for automotive applications, where it helps in managing sensor inputs and real-time processing for advanced driver-assistance systems (ADAS).
  • Industrial Automation: In industrial settings, the FPGA excels in controlling machinery, process automation, and monitoring systems, enhancing operational efficiency and safety.
  • Consumer Electronics: It is also used in consumer electronics, such as smart home devices and entertainment systems, where flexibility and processing power are required for multimedia and connectivity features.
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