AFS1500-FG676

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Mfr.Part #
AFS1500-FG676
Manufacturer
Microchip Technology
Package / Case
676-BGA
Datasheet
Download
Description
IC FPGA 252 I/O 676FBGA
Stock
43,663
In Stock :
43,663

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Manufacturer :
Microchip Technology
Product Category :
FPGAs (Field Programmable Gate Array)
Packaging :
Tray
Number of Gates :
1500000
Mounting Type :
Surface Mount
Factory Lead Time :
12 Weeks
Number of Pins :
676
Mount :
Surface Mount
Operating Temperature :
0°C~85°C TJ
Number of Registers :
38400
Number of I/O :
252
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Min Supply Voltage :
1.425V
Package / Case :
676-BGA
Length :
27mm
Max Operating Temperature :
70°C
Max Frequency :
1.0989GHz
Min Operating Temperature :
0°C
Weight :
400.011771mg
Base Part Number :
AFS1500
Supplier Device Package :
676-FBGA (27x27)
Radiation Hardening :
No
RAM Size :
33.8kB
Max Supply Voltage :
1.575V
Voltage - Supply :
1.425V~1.575V
Series :
Fusion®
Height :
1.73mm
Operating Supply Voltage :
1.5V
Published :
2013
Lifecycle Status :
IN PRODUCTION (Last Updated: 2 weeks ago)
Width :
27mm
RoHS Status :
Non-RoHS Compliant
Frequency :
1.0989GHz
Total RAM Bits :
276480
Datasheets
AFS1500-FG676
Introducing FPGAs (Field Programmable Gate Array) Microchip Technology AFS1500-FG676 from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Number of Pins:676, Operating Temperature:0°C~85°C TJ, Package / Case:676-BGA, Base Part Number:AFS1500, AFS1500-FG676 pinout, AFS1500-FG676 datasheet PDF, AFS1500-FG676 amp .Beyond FPGAs (Field Programmable Gate Array) Microchip Technology AFS1500-FG676 ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.



1.5V V FPGAs Fusion® Series 1.0989GHz MHz 676-BGA

AFS1500-FG676 Overview


In the package 676-BGA, this product is provided. A total of 252 I/Os are programmed to ensure a more coherent data transfer. By attaching the Surface Mount connector, you can use this FPGA module with your development board. With a supply voltage of 1.425V~1.575V, this device operates with ease. This is a type of FPGA that is part of the Fusion® series of FPGAs. Fpga chips is necessary to keep the operating temperature wFpga chipshin 0°C~85°C TJ when the device is operating. As a result of space limitations, this FPGA model has been included in Tray. Fpga electronics is worth mentioning that this device provides 276480 bfpga electronics s of RAM. AFS1500 is the base part number that can be used to identify related parts. The RAM si33.8kBe of this FPGA module reaches 33.8kB so as to guarantee the normal operation of the program during operation. The device has 676 pins which are included in the design. I think, as long as this FPGA is mounted in Surface Mount, it could perform excellently according to its specifications as long as you mount it in Surface Mount. In operation with 1.5V, designers can take advantage of its flexibility to the fullest extent. This module can reach a maximum operating temperature of 70°C when operating at its maximum power. Fpga electronics is necessary to maintain an operating temperature higher than 0°C. A basic building block for this type of building block consists of 1500000 gates. The structure of the registers used to store and transfer data consists of 38400 registers. The system operates at a frequency of 1.0989GHz in order to achieve maximum efficiency. The maximum supply voltage it can take is 1.575V. The device can function at a minimum voltage of 1.425V. In fact, this FPGA is capable of reaching a speed of 1.0989GHz. As a supplier, 676-FBGA (27x27) is responsible for the package of its devices.

AFS1500-FG676 Features


252 I/Os
Up to 276480 RAM bits
676 LABs/CLBs
70°C gates
38400 registers
Operating from a frequency of 1.0989GHz


AFS1500-FG676 Applications


There are a lot of Microsemi Corporation
AFS1500-FG676 FPGAs applications.


  • Voice recognition
  • Cryptography
  • Filtering and communication encoding
  • Aerospace and Defense
  • Medical Electronics
  • Audio
  • Automotive
  • Consumer Electronics
  • Distributed Monetary Systems
  • Data Center
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