A42MX36-3BG272

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Mfr.Part #
A42MX36-3BG272
Manufacturer
Microchip Technology
Package / Case
272-BBGA
Datasheet
Download
Description
IC FPGA 202 I/O 272BGA
Stock
12,269
In Stock :
12,269

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Manufacturer :
Microchip Technology
Product Category :
FPGAs (Field Programmable Gate Array)
Published :
2009
Operating Supply Voltage :
5V
Voltage - Supply :
3V~3.6V 4.75V~5.25V
Series :
MX
Number of Gates :
54000
Number of Logic Blocks (LABs) :
1184
Number of Registers :
1822
Total RAM Bits :
2560
Factory Lead Time :
20 Weeks
Length :
27mm
Packaging :
Tray
Number of I/O :
202
Lifecycle Status :
IN PRODUCTION (Last Updated: 3 weeks ago)
Base Part Number :
A42MX36
Max Operating Temperature :
70°C
Height :
1.73mm
Max Supply Voltage :
5.25V
Min Operating Temperature :
0°C
Operating Temperature :
0°C~70°C TA
RoHS Status :
Non-RoHS Compliant
Number of Logic Elements/Cells :
1184
Width :
27mm
Speed Grade :
3
Radiation Hardening :
No
Number of Pins :
272
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Supplier Device Package :
272-PBGA (27x27)
RAM Size :
320B
Mounting Type :
Surface Mount
Mount :
Surface Mount
Max Frequency :
180MHz
Package / Case :
272-BBGA
Min Supply Voltage :
3V
Datasheets
A42MX36-3BG272
Introducing FPGAs (Field Programmable Gate Array) Microchip Technology A42MX36-3BG272 from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:A42MX36, Operating Temperature:0°C~70°C TA, Number of Pins:272, Mounting Type:Surface Mount, Package / Case:272-BBGA, A42MX36-3BG272 pinout, A42MX36-3BG272 datasheet PDF, A42MX36-3BG272 amp .Beyond FPGAs (Field Programmable Gate Array) Microchip Technology A42MX36-3BG272 ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Microchip Technology A42MX36-3BG272


FPGAs Microchip Technology A42MX36-3BG272 Overview

Introducing the A42MX36-3BG272 from Microchip Technology, a leading-edge Field Programmable Gate Array (FPGA) that offers high flexibility and performance for a broad range of applications. This FPGA is tailored to meet the rigorous demands of modern electronic environments, featuring a robust 272-ball grid array package (BGA) that ensures reliable connectivity and performance. The A42MX36-3BG272 is designed for designers who need a dense, programmable logic solution that can handle a high number of input/output options with a compact footprint, making it an ideal choice for advanced digital circuit development.

A42MX36-3BG272 Features

The A42MX36-3BG272 FPGA boasts 202 I/O pins, providing ample connectivity for complex designs. This high level of integration facilitates the development of applications requiring multiple connections and high-speed interfaces. The BGA package enhances thermal management and offers superior reliability and durability under challenging conditions, making it suitable for both industrial applications and consumer electronics. The FPGA's programmable logic capabilities allow for rapid prototyping and adjustments, which significantly reduces development time and costs.

A42MX36-3BG272 Applications

  • Automotive Electronics: Utilize in control systems and infotainment. The A42MX36-3BG272's high I/O count and robust packaging are ideal for managing multiple sensors and outputs in vehicle electronics.
  • Industrial Automation: Deploy in machinery control systems. This FPGA can handle complex logic operations required for automation processes, enhancing operational efficiency and reliability.
  • Data Processing: Use in servers and data centers for handling large-scale data operations. Its ability to be reprogrammed on the fly makes it a crucial component for data-intensive applications that require frequent updates and modifications.
  • Telecommunications: Ideal for signal processing and network infrastructure. The high-performance capabilities of the A42MX36-3BG272 help in managing multiple data streams efficiently, ensuring smooth communication channels.
  • Consumer Electronics: Implement in devices such as smart TVs and gaming consoles. The FPGA contributes to enhancing multimedia processing and connectivity, offering a richer user experience.
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