A3P600L-FG256I

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Mfr.Part #
A3P600L-FG256I
Manufacturer
Microsemi
Package / Case
256-LBGA
Datasheet
Download
Description
IC FPGA 177 I/O 256FBGA
Stock
33,933
In Stock :
33,933

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Manufacturer :
Microsemi
Product Category :
FPGAs (Field Programmable Gate Array)
Total RAM Bits :
110592
Operating Temperature :
-40°C~100°C TJ
Series :
ProASIC3L
Base Part Number :
A3P600L
Number of Gates :
600000
Power Supplies :
1.5/3.3V
Number of Terminations :
256
Radiation Hardening :
No
RAM Size :
13.5kB
Mount :
Surface Mount
Mounting Type :
Surface Mount
Operating Supply Current :
5mA
Number of I/O :
177
Weight :
400.011771mg
Peak Reflow Temperature (Cel) :
225
Voltage - Supply :
1.14V~1.575V
Number of Pins :
256
HTS Code :
8542.39.00.01
Supply Voltage :
1.2V
Terminal Pitch :
1mm
RoHS Status :
Non-RoHS Compliant
Length :
17mm
Terminal Form :
Ball
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Width :
17mm
Operating Supply Voltage :
1.2V
Package / Case :
256-LBGA
Terminal Finish :
TIN LEAD/TIN LEAD SILVER
Time@Peak Reflow Temperature-Max (s) :
30
Published :
2013
Packaging :
Tray
Number of Registers :
13824
Height :
1.2mm
Number of Outputs :
177
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Max Frequency :
781.25MHz
Terminal Position :
BOTTOM
Datasheets
A3P600L-FG256I
Introducing FPGAs (Field Programmable Gate Array) Microsemi A3P600L-FG256I from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C~100°C TJ, Base Part Number:A3P600L, Number of Terminations:256, Mounting Type:Surface Mount, Number of Pins:256, Package / Case:256-LBGA, A3P600L-FG256I pinout, A3P600L-FG256I datasheet PDF, A3P600L-FG256I amp .Beyond FPGAs (Field Programmable Gate Array) Microsemi A3P600L-FG256I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Microsemi A3P600L-FG256I


FPGAs Microsemi A3P600L-FG256I Overview

The FPGAs Microsemi A3P600L-FG256I represents a highly capable FPGA designed to meet the rigorous demands of modern digital circuits. Manufactured by Microsemi, a leader in integrated circuit solutions, this FPGA is housed in a 256FBGA package, offering a compact form factor without sacrificing performance. With 177 I/O pins, it provides ample connectivity for a wide range of applications, from complex industrial systems to sophisticated communication devices. Its efficient architecture ensures high-speed operation and low power consumption, making it an ideal choice for developers looking to optimize their systems for performance and energy efficiency.

A3P600L-FG256I Features

  • 177 I/O pins for extensive connectivity
  • 256FBGA package for reduced size and improved thermal management
  • Low power consumption, enhancing device sustainability
  • Robust performance suitable for high-speed digital processing

A3P600L-FG256I Applications

  • Telecommunications Equipment: Used in routers and switches to manage data traffic efficiently and reliably.
  • Consumer Electronics: Powers features in devices such as smart TVs and gaming consoles, enabling sophisticated user interfaces and connectivity.
  • Automotive Systems: Utilized in vehicle telematics systems to enhance functionality like GPS navigation and in-car entertainment.
  • Industrial Automation: Helps in the control systems of manufacturing equipment, increasing precision and productivity.
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