A3P600L-FG256

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Mfr.Part #
A3P600L-FG256
Manufacturer
Microsemi
Package / Case
256-LBGA
Datasheet
Download
Description
IC FPGA 177 I/O 256FBGA
Stock
16,402
In Stock :
16,402

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Manufacturer :
Microsemi
Product Category :
FPGAs (Field Programmable Gate Array)
Radiation Hardening :
No
Operating Supply Current :
5mA
Operating Temperature :
0°C~85°C TJ
Supplier Device Package :
256-FPBGA (17x17)
Min Supply Voltage :
1.14V
Base Part Number :
A3P600L
Min Operating Temperature :
0°C
Number of I/O :
177
Number of Registers :
13824
Height :
1.2mm
Number of Gates :
600000
Voltage - Supply :
1.14V~1.575V
Operating Supply Voltage :
1.2V
Max Frequency :
781.25MHz
Mounting Type :
Surface Mount
Number of Pins :
256
Packaging :
Tray
Max Supply Voltage :
1.26V
Length :
17mm
Total RAM Bits :
110592
RAM Size :
13.5kB
Weight :
400.011771mg
Mount :
Surface Mount
Package / Case :
256-LBGA
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
RoHS Status :
Non-RoHS Compliant
Width :
17mm
Max Operating Temperature :
70°C
Published :
2009
Series :
ProASIC3L
Datasheets
A3P600L-FG256
Introducing FPGAs (Field Programmable Gate Array) Microsemi A3P600L-FG256 from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C~85°C TJ, Base Part Number:A3P600L, Mounting Type:Surface Mount, Number of Pins:256, Package / Case:256-LBGA, A3P600L-FG256 pinout, A3P600L-FG256 datasheet PDF, A3P600L-FG256 amp .Beyond FPGAs (Field Programmable Gate Array) Microsemi A3P600L-FG256 ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Microsemi A3P600L-FG256


FPGAs Microsemi A3P600L-FG256 Overview

The Microsemi A3P600L-FG256 FPGA offers a highly flexible and scalable architecture that is designed to cater to a wide range of industrial applications. This FPGA is part of Microsemi's well-regarded FPGA product line and offers a robust solution with its 256FBGA packaging, ensuring optimal functionality in compact spaces. The A3P600L-FG256 is specifically tailored for applications requiring significant I/O capabilities, with 177 I/O pins available, making it an ideal choice for complex digital systems. This product integrates seamlessly into various design schemas, providing engineers with a versatile tool to optimize system performance and enhance reliability.

A3P600L-FG256 Features

This FPGA is characterized by its high functionality and adaptability, making it suitable for a multitude of advanced applications. Key features include its 256FBGA packaging, which allows for a more efficient layout and better heat dissipation, and its 177 I/O pins, which provide ample connectivity for multiple peripherals. Additionally, the FPGA is designed to support a variety of logic densities, enabling designers to match the specific needs of their applications without compromising on performance or size.

A3P600L-FG256 Applications

  • Automotive Applications: The A3P600L-FG256 can be integrated into automotive safety and control systems, providing the necessary I/O capabilities and reliability required in harsh automotive environments.
  • Industrial Automation: This FPGA is ideal for controlling machinery and processes in industrial settings, where its ability to handle multiple inputs and outputs can be used to streamline complex control systems.
  • Data Processing: Suitable for data-intensive applications, the A3P600L-FG256 can be utilized in servers and storage solutions to enhance data throughput and system efficiency.
  • Telecommunication Infrastructure: The high I/O count and robustness of the A3P600L-FG256 make it suitable for telecommunications equipment, including switches and routers, where reliable data processing and throughput are crucial.
  • Consumer Electronics: This FPGA is also adaptable for use in consumer electronics, such as smart home devices and entertainment systems, where versatility and performance are key.
This HTML content is crafted to promote the FPGA's versatility and its suitability for various high-demand applications, emphasizing its robust feature set and adaptability to attract B2B customers looking for scalable and reliable FPGA solutions.
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